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市場調查報告書
商品編碼
1496041

半導體記憶體市場:2024年至2029年預測

Semiconductor Memory Market - Forecasts from 2024 to 2029

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 115 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

半導體記憶體市場預計將從 2022 年的 1,556.8 億美元增至 2029 年的 1,634.13 億美元,預測期內複合年成長率為 0.69%。

半導體元件在汽車、家用電器和 IT/通訊等各個行業中的使用不斷增加,預計將推動該市場的全球成長。半導體是重要的電子設備,使用積體電路 (IC) 技術充當電腦記憶體和晶片。半導體技術的進步,例如精製程序、能源效率和晶片容量的最佳化,為適合各行業的創新記憶體解決方案打開了大門。

此外,隨著智慧型手機和其他行動裝置的普及,高效能可以透過提供無縫的用戶體驗、快速的應用程式載入時間和無縫的多工功能來滿足現代用戶不斷變化的需求和願望,對晶片的需求前所未有。例如,根據國際數據公司(IDC)全球季度手機追蹤報告,印度智慧型手機市場2023年出貨量為1.46億部,名目與前一年同期比較為1%。上半年大幅下降10%,但下半年年增11%。 23年第4季出貨量為3,700萬台,較去年同期成長26%。這主要是由於下半年出貨量高於預期,包括推出多款新車型。

此外,穿戴式裝置、智慧型手機和電子產品等創新產品中積極採用以記憶體為中心的組件也推動了市場成長。此外,電子和汽車產業對 DRAM 和快閃 ROM 等半導體元件日益依賴也明顯的推動了對整合晶片和裝置的需求。全球對智慧型設備、消費性電子產品、智慧型手機和工作站的需求強調了對具有先進技術的晶片的需求。因此,市場正在經歷一個顯著擴張的時期,為涉足該領域的公司提供了許多商機。

汽車行業不斷成長的需求預計將推動市場成長。

由於其卓越的性能和低功耗,記憶體解決方案擴大用於汽車安全系統。記憶體解決方案對於開發自動駕駛功能至關重要,尤其是全面的汽車資訊娛樂 (IVI) 系統和車聯網 (V2X) 連線。這些技術需要強大的記憶體解決方案,而三星等公司處於領先地位。因此,這些因素預計將在預測期內推動全球半導體記憶體市場的成長。

此外,由於現代汽車中軟體和電子元件的使用不斷增加,市場正在擴大。隨著汽車日益互聯並與智慧技術整合,對大容量記憶體解決方案的需求不斷增加,從而推動了市場成長。由於混合動力汽車和電動車 (EV) 的普及,市場正在不斷擴大,這需要先進的記憶體系統來提高能源效率和電池管理。例如,根據國際能源總署的數據,美國純電動汽車保有量從2021年的150萬輛增加到2022年的210萬輛。

此外,人工智慧(AI)和機器學習(ML)在汽車系統中擴大用於自動駕駛和預測性維護等應用,也是市場成長的積極因素。此外,製造商的最新創新使他們能夠在快速變化的市場中保持競爭力。例如,2023年7月,全球大型公司的尖端半導體技術供應商三星電子宣布推出專為汽車資訊娛樂(IVI)系統設計的新型汽車通用快閃記憶體(UFS)3.1記憶體解決方案。這項新解決方案具有業界最低的消費量,使汽車製造商能夠為其客戶提供最佳的行動體驗。為了滿足不同客戶的需求,UFS 3.1提供128GB、256GB和512GB系列。該產品線的增強將使電動車和無人駕駛汽車等未來汽車應用中的電池壽命管理更加有效。

半導體記憶體市場的 NAND 領域預計將推動市場成長。

NAND快閃記憶體快閃記憶體是非易失性存儲,無需電源即可保留資料。 NAND快閃記憶體進步的主要目標是降低每位元的成本並增加晶片的容量,使其能夠與硬碟等磁性儲存競爭。 NAND快閃記憶體存在定期上傳或交換大型檔案的裝置中很受歡迎,例如 MP3 播放器、數位相機和 USB 隨身碟。

NAND快閃記憶體以區塊的形式儲存資料,並使用電路來儲存資料。當斷電時,金屬氧化物半導體(通常是浮動柵電晶體(FGT))向儲存單元提供額外的電荷並儲存資料。這些 FGT 的結構與 NAND 邏輯閘類似。 NAND 儲存單元由兩種類型的閘組成:控制閘和浮動閘門,兩者都控制資料流。若要對單元進行編程,請向控制閘極施加電壓。

韓國在記憶體晶片生產中佔據主導地位,三星電子和SK海力士佔據全球DRAM市場的73%和NAND快閃記憶體市場的51%。然而,對於微處理器和感測器等不同的半導體產品,韓國公司依靠政府主導來加強該產業。

半導體記憶體市場 NAND 領域的產業參與企業正專注於併購以擴大供應鏈。

兩家公司都尋求獲得必要的政府批准。在獲得這些核准後,SK海力士以70億美元的首期付款收購了NAND​​ SSD業務(包括相關IP和員工)和大連工廠。剩餘資產,包括與NAND快閃記憶體晶圓製造和設計相關的智慧財產權、研發員工以及大連工廠的員工,在最終交割後由 SK 海力士以 20 億美元的額外價格收購。根據協議,英特爾將繼續在大連內存製造廠生產 NAND 晶圓,並保留與NAND快閃記憶體晶圓製造和設計相關的所有智慧財產權,直至最終交割。

預計美洲地區市場將會成長。

由於多種因素,包括技術創新和對高效能運算的需求不斷成長,美國半導體記憶體市場預計將成長。這種高效能運算包括資料中心、人工智慧、邊緣運算等多個領域所使用的服務。

美國半導體產業對 2021 年 GDP附加價值毛額(GVA) 的貢獻顯著,總計 2,464 億美元。其中直接 GVA 為 558 億美元,間接 GVA 為 986 億美元,誘導 GVA 為 920 億美元。半導體產業的強勁表現反映了其在美國經濟中的重要地位,並對預測期內半導體記憶體市場的提振發揮了重要作用。

此外,對高效能運算的需求不斷成長以及5G服務使用量的快速增加正在進一步推動半導體記憶體市場。例如,歐盟委員會於 2020 年 10 月普及服務基金,為通訊業者提供高達90 億美元的資金,用於在美國農村提供先進的5G 行動無線服務(高達60 億美元用於在部落地區部署) 。此外,該基金明確授權至少 10 億美元用於支持精密農業需求的部署。

半導體產業受到美國政府國內重點的影響較大。 2020年至2022年,美國和國際公司進行了超過2,000億美元的私人投資,以提高16個州的半導體製造、設備和材料的國內製造能力。最大的投資是位於亞利桑那州、德克薩斯、愛達荷州、俄亥俄州和紐約州的邏輯和儲存晶片製造設施。

此外,主要市場參與者的各種產品發布和創新也進一步推動了市場的發展。例如,2022 年 7 月,尖端NAND快閃記憶體和 DRAM 記憶體設計先驅 NEO Semiconductor 宣布推出第二代 X-NAND架構。此外,2022年8月,全球最大的半導體公司之一、唯一總部位於美國的記憶體製造商美光科技宣布,將在未來10年投資400億美元開發尖端技術,並已宣布有意向在美國建立不同階段的記憶體生產。總體而言,這些創新策略在該國推出了各種產品,並對市場產生了積極影響。

主要市場開拓:

  • 2020年10月20日,SK海力士與英特爾宣布達成協議,SK海力士將以90億美元收購英特爾的NAND記憶體和儲存業務。其中包括 NAND SSD 業務、NAND 元件和晶圓業務以及位於中國的大連 NAND 記憶體製造廠。英特爾計劃將其英特爾(R) OptaneTM 業務分開。

主要參與者

  • 三星的 DRAM 技術推動了從個人電腦到先進人工智慧伺服器等各種運算解決方案的創新並提高了效能。三星提供多種 DRAM 產品以滿足不同需求。例如,三星的 DDR 解決方案針對高效能伺服器、桌上型電腦、筆記型電腦和其他裝置進行了最佳化。
  • 東芝開發了 128 GB嵌入式NAND快閃記憶體模組,樹立了新的產業容量標準。此模組符合 e*MMCTM 標準,適用於智慧型手機、平板電腦和數位攝影機等各種數位消費產品。東芝提供單封裝嵌入式NAND快閃記憶體閃存,容量範圍從​​ 2GB 到 128GB。
  • SK 海力士提供多種 DRAM 產品,滿足各種需求。其中包括用於伺服器的 RDIMM 和 LRDIMM,以及用於 PC 的 UDIMM 和 SODIMM。該公司的 DDR 解決方案可確保快速計算和可靠的資料傳輸。該公司的 GDDR 記憶體有助於快速渲染複雜圖形,提供逼真的視覺體驗。

目錄

第1章簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章半導體記憶體市場:按類型

  • 介紹
  • NAND
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • DRAM
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力

第6章半導體記憶體市場:依行業分類

  • 介紹
  • 家用電器
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 通訊科技
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力
  • 製造業
    • 市場趨勢和機遇
    • 成長前景
    • 地域獲利能力

第7章半導體記憶體市場:按地區

  • 介紹
  • 美洲
    • 按類型
    • 按行業分類
    • 按國家/地區
  • 歐洲、中東/非洲
    • 按類型
    • 按行業分類
    • 按國家/地區
  • 亞太地區
    • 按類型
    • 按行業分類
    • 按國家/地區

第8章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章 公司簡介

  • Samsung Corporation
  • Intel Corporation
  • Micron Technology
  • SK Hynix
  • Western Digital Corporation
  • Toshiba Corporation
  • ATP Electronics
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
  • Infineon Technologies AG
  • IBM Corporation
簡介目錄
Product Code: KSI061612437

The semiconductor memory market is anticipated to grow at a compound annual growth rate (CAGR) of 0.69% over the forecast period to reach US$163.413 billion by 2029, increasing from US$155.68 billion in 2022.

The growing use of semiconductor components in a variety of industries, such as automotive, consumer electronics, and IT & telecom, is expected to propel the market''s growth on a global basis. It is a necessary electronic device that uses integrated circuit (IC) technology to function as computer memory or chips. The development of semiconductor technology, which includes refining procedures, energy efficiency, and chip capacity optimization, has opened the door for innovative memory solutions suited to various industries.

Moreover, the widespread use of smartphones and other portable devices has created an unprecedented demand for high-performance chips that can meet the changing needs and aspirations of modern users by providing seamless user experiences, quick app loading times, and seamless multitasking capabilities. For instance, in 2023, the smartphone market in India shipped 146 million units, exhibiting a nominal year-over-year (YoY) growth of 1%, as per the International Data Corporation's (IDC) Worldwide Quarterly Mobile Phone Tracker. After a steep 10% drop in the first half of the year, the second half of the year grew by 11% YoY in 2H23. With 37 million units shipped, 4Q23 grew by 26% YoY. This was largely due to stronger-than-expected shipments in the second half of the quarter, which included the launch of several new models.

Additionally, the market's growth is also being driven by the dynamic adoption of memory-centric components in innovative products like wearables, smartphones, and electronic gadgets. In addition, the growing dependence of the electronics and automotive industries on semiconductor devices-such as DRAM and Flash ROM-is clearly driving up demand for integrated chips and devices. The demand for smart devices, consumer electronics, smartphones, and workstations across the globe emphasizes the need for chips with advanced technology. As a result, the market is experiencing a remarkable period of expansion, offering numerous opportunities for companies involved in this sector.

Growing demand from the automotive industry is anticipated to propel market growth.

Memory solutions are increasingly being used in automotive safety systems due to their excellent performance and low power consumption benefits. Memory solutions are essential to the development of autonomous driving capabilities, especially for comprehensive in-vehicle infotainment (IVI) systems and vehicle-to-everything (V2X) connectivity. Power memory solutions are needed for these technologies, and Samsung and other companies are leading the charge. Consequently, during the projected period, these factors are anticipated to fuel the growth of the global semiconductor memory market.

Moreover, the market is also growing due to the increasing use of software and electronic components in modern vehicles. Accordingly, as cars get increasingly linked and integrated with smart technologies, there is an increasing need for high-capacity memory solutions, which is driving up market growth. The market is expanding due to the increased use of hybrid and electric vehicles (EVs), which need sophisticated memory systems for energy efficiency and battery management. For instance, according to the International Energy Agency, the stock of battery electric vehicles increased in the United States from 1.5 million in 2021 to 2.1 million in 2022.

Additionally, a favorable outlook for market growth is being created by the growing use of artificial intelligence (AI) and machine learning (ML) in automotive systems for applications like autonomous driving and predictive maintenance. Moreover, modern innovations from manufacturers are enable to keep a competitive edge in a market that is changing rapidly. For instance, in July 2023, a leading global provider of cutting-edge semiconductor technology, Samsung Electronics, announced that mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution, which is designed for in-car infotainment (IVI) systems, has begun. With the lowest energy consumption in the industry, the new solution enables automakers to give customers the best possible mobility experience. To accommodate varying customer needs, the UFS 3.1 lineup was made available in 128, 256, and 512 gigabytes (GB) variants. The improved lineup enables future automotive applications, like electric or driverless vehicles, to manage battery life more effectively.

The NAND segment of the semiconductor memory market is anticipated to propel market growth.

NAND flash memory is a non-volatile storage that preserves data without needing power. A key aim in NAND flash advancement has been to lower the cost per bit and boost chip capacity, allowing it to compete with magnetic storage like hard disks. It NAND flash is popular in devices where large files, such as MP3 players, digital cameras, and USB flash drives, are regularly uploaded and swapped out,

NAND flash stores data in blocks and utilizes electric circuits for data storage. When power is disconnected, a metal-oxide-semiconductor, usually a floating-gate transistor (FGT), supplies additional charge to the memory cell, preserving the data. These FGTs resemble NAND logic gates in structure. NAND memory cells consist of two kinds of gates: control gates and floating gates, both of which regulate data flow. To program a cell, a voltage charge is applied to the control gate.

South Korea dominates memory chip production, with Samsung Electronics and SK Hynix holding 73% of the global DRAM market and 51% of the NAND flash market. However, for different semiconductor products like microprocessors and sensors, South Korean firms depend on various government-led initiatives to strengthen the industry .

Industry participants in the NAND segment of the semiconductor memory market concentrate on mergers and acquisitions to expand their supply chain.

Both companies aimed to secure necessary governmental approvals. After obtaining those approvals, SK Hynix purchased the NAND SSD business (including associated IP and employees) and the Dalian facility for an initial payment of $7 billion. The remaining assets, including IP related to NAND flash wafer manufacturing and design, R&D employees, and the Dalian fab workforce, were acquired by SK Hynix upon a final closing, with a further payment of $2 billion. According to the agreement, Intel will continue producing NAND wafers at the Dalian Memory Manufacturing Facility and retain all IP related to NAND flash wafer manufacturing and design until the final closing.

The market is projected to grow in the America's region.

The United States, semiconductor memory market is anticipated to grow owing to various factors, including technological innovation, and growing demand for high-performance computing. This high-performance computing includes services used in multiple sectors including data centers, artificial AI, and edge computing.

With a total of $246.4 billion in 2021, the semiconductor sector in the United States contributed significantly to the GDP's Gross Value Added (GVA). This included $55.8 billion in direct GVA, $98.6 billion in indirect GVA, and $92.0 billion in induced GVA. The semiconductor industry's strong performance is a reflection of its vital position in the American economy and plays a significant role in fueling the semiconductor memory market during the forecast period.

Furthermore, the increasing need for high-performance computing and the burgeoning use of 5G services are further driving the semiconductor memory market. For instance, to provide carriers with up to $9 billion in Universal Service Fund funding to provide advanced 5G mobile wireless services in rural America (including up to $680 million for deployment on tribal territories), the Commission created the 5G Fund for Rural America in October 2020. Additionally, the Fund allows at least $1 billion expressly for deployments supporting the requirements of precision agriculture .

The semiconductor industry is greatly impacted by the growing focus of the United States government on in the nation. Over $200 billion in private investments were made by American and international companies between 2020 and 2022 to increase domestic manufacturing capacities for semiconductor fabrication, equipment, and materials across 16 states. The largest investments went towards logic and memory chip fabrication facilities in Arizona, Texas, Idaho, Ohio, and New York.

Furthermore, various product launches and innovations by key market players are further boosting the market. For instance, in July 2022, NEO Semiconductor, a pioneer in the creation of cutting-edge NAND flash and DRAM memory designs, announced the availability of its second-generation X-NAND architecture. Furthermore, in August 2022, one of the biggest semiconductor firms in the world and the only memory maker with headquarters in the United States, Micron Technology, Inc. revealed its intentions to invest $40 billion by the end of the decade to establish state-of-the-art memory production in various stages in the United States. Comprehensively, these innovative strategies lead to various product launches in the nation, impacting the market positively.

Key Market Developments:

  • October 20, 2020, SK Hynix and Intel announced a deal where SK Hynix would acquire Intel's NAND memory and storage business for $9 billion. This included the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel plans to keep its Intel(R) OptaneTM business separate.

Key Players:

  • Samsung's DRAM technology fuels innovation and boosts performance across a range of computing solutions, spanning from personal computers to advanced AI servers. Samsung offers a diverse collection of DRAM products tailored to meet different needs. For instance, Samsung's DDR solutions are optimized for high-performance servers, desktops, laptops, and other devices. These solutions prioritize both high bandwidth and energy efficiency, delivering enhanced performance.
  • Toshiba Corporation developed a 128-gigabyte (GB) embedded NAND flash memory module, setting a new industry standard for capacity. The module adhered to the e*MMCTM standard and is intended for use in various digital consumer products like smartphones, tablet PCs, and digital video cameras. Toshiba offers a wide range of single-package embedded NAND Flash memories with capacities ranging from 2GB to 128 GB .
  • SK Hynix provides a diverse selection of DRAM products catering to various needs. These include RDIMM and LRDIMM, which are for server applications, and UDIMM and SODIMM designed for personal computer usage. Their DDR solutions ensure swift computing and reliable data transfers. Their GDDR memory facilitates the rapid rendering of complex graphics, delivering realistic visual experiences .

Segmentation:

By Type:

  • NAND
  • DRAM

By Industry Vertical:

  • Consumer Electronics
  • Communication & Technology
  • Automotive
  • Manufacturing

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key Benefits for the Stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR MEMORY MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. NAND
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. DRAM
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness

6. SEMICONDUCTOR MEMORY MARKET BY INDUSTRY VERTICAL

  • 6.1. Introduction
  • 6.2. Consumer Electronics
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Communication & Technology
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Automotive
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Manufacturing
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness

7. SEMICONDUCTOR MEMORY MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. Americas
    • 7.2.1. By Type
    • 7.2.2. By Industry Vertical
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Brazil
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
      • 7.2.3.4. Others
        • 7.2.3.4.1. Market Trends and Opportunities
        • 7.2.3.4.2. Growth Prospects
  • 7.3. Europe, Middle East, and Africa
    • 7.3.1. By Type
    • 7.3.2. By Industry Vertical
    • 7.3.3. By Country
      • 7.3.3.1. Germany
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. France
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. United Kingdom
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
      • 7.3.3.4. Italy
        • 7.3.3.4.1. Market Trends and Opportunities
        • 7.3.3.4.2. Growth Prospects
      • 7.3.3.5. Others
        • 7.3.3.5.1. Market Trends and Opportunities
        • 7.3.3.5.2. Growth Prospects
  • 7.4. Asia Pacific
    • 7.4.1. By Type
    • 7.4.2. By Industry Vertical
    • 7.4.3. By Country
      • 7.4.3.1. China
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. Japan
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. India
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Taiwan
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Samsung Corporation
  • 9.2. Intel Corporation
  • 9.3. Micron Technology
  • 9.4. SK Hynix
  • 9.5. Western Digital Corporation
  • 9.6. Toshiba Corporation
  • 9.7. ATP Electronics
  • 9.8. Taiwan Semiconductor Manufacturing Company Limited
  • 9.9. Texas Instruments Incorporated
  • 9.10. Infineon Technologies AG
  • 9.11. IBM Corporation