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市場調查報告書
商品編碼
1263833

半導體組裝、檢驗受託的全球市場 (2023-2028年):趨勢、成長機會、競爭分析

Outsourced Semiconductor Assembly and Testing Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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簡介目錄

全球半導體組裝、檢驗受託的市場規模，從2023年到2028年預計以6.3％的年複合成長率發展，2028年成長到368億美元的規模。

為了提供更高機能且高等級效能的電子產品增加加入半導體內容，智慧型手機和網際網路連網型設備的需求增加，安全性，導航，耗油量，排放降低，娛樂系統等汽車內的電子內容增加等要素促進該市場的成長。

本報告提供全球半導體組裝、檢驗受託的市場調查，市場背景、概要，市場影響因素的分析，市場規模的變化、預測，各種區分、各地區/主要國家的明細，競爭情形，成長機會、策略分析，主要企業簡介等彙整資訊。

目錄

第1章 摘要整理

第2章 全球半導體組裝、檢驗受託市場:市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業的推進因素與課題

第3章 市場趨勢、預測分析

  • 宏觀經濟趨勢、預測
  • 全球半導體組裝、檢驗受託市場趨勢、預測
  • 全球半導體組裝、檢驗受託市場:各服務形式
    • 裝配、包裝
    • 檢驗
  • 全球半導體組裝、檢驗受託市場:各包裝類型
    • 線公債
    • 覆晶
    • 晶圓構裝
    • 其他
  • 全球半導體組裝、檢驗受託市場:各用途
    • 汽車
    • 通訊
    • 運算、網路
    • CE產品
    • 工業

第4章 市場趨勢、預測分析:各地區

  • 全球半導體組裝、檢驗受託市場:各地區
  • 北美
  • 歐洲
  • 亞太地區
  • 其他地區

第5章 競爭企業的分析

  • 產品系列分析
  • 運用整合
  • 波特的五力分析

第6章 成長機會及策略分析

  • 成長機會分析
  • 新的趨勢
  • 策略分析

第7章 主要企業簡介

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI(Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS
簡介目錄

Outsourced Semiconductor Assembly and Testing Market Trends and Forecast

The future of the global outsourced semiconductor assembly and testing (OSAT) market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial industries. The global outsourced semiconductor assembly and testing market is expected to reach an estimated $36.8 billion by 2028 with a CAGR of 6.3% from 2023 to 2028. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Outsourced Semiconductor Assembly and Testing Market (OSAT) by Segment

The study includes a forecast for the global outsourced semiconductor assembly and testing market by service type, packaging type, application, and region, as follows:

OSAT Market by Service Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Assembly & Packaging
  • Testing

OSAT Market by Packaging Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Wire Bond
  • Flip Chip
  • Wafer Level
  • Others

OSAT Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Automotive
  • Telecommunications
  • Computing & Networking
  • Consumer Electronics
  • Industrial

OSAT Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Outsourced Semiconductor Assembly and Testing (OSAT) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies outsourced semiconductor assembly and testing companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the outsourced semiconductor assembly and testing companies profiled in this report includes.

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI (Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS

OSAT Market Insights

  • Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.
  • Within this market, consumer electronics segment is projected to record the highest growth due to growing acceptance of 5G technologies and increasing consumption of smart televisions, tablets, and smartphones.
  • Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Features of the OSAT Market

  • Market Size Estimates:Outsourced semiconductor assembly and testing market size estimation in terms of value ($B)
  • Trend And Forecast Analysis:Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis:Outsourced semiconductor assembly and testing market size by various segments, such as by service type, packaging type, application, and region
  • Regional Analysis:Outsourced semiconductor assembly and testing market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities:Analysis on growth opportunities in different by service type, packaging type, application, and regions for the outsourced semiconductor assembly and testing market.
  • Strategic Analysis:This includes M&A, new product development, and competitive landscape for the outsourced semiconductor assembly and testing market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the outsourced semiconductor assembly and testing (OSAT) market size?

Answer: The global outsourced semiconductor assembly and testing (OSAT) market is expected to reach an estimated $36.8 billion by 2028.

Q2. What is the growth forecast for the OSAT market?

Answer: The global outsourced semiconductor assembly and testing market is expected to grow with a CAGR of 6.3% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the OSAT market?

Answer: The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Q4. What are the major segments for OSAT market?

Answer: The future of the outsourced semiconductor assembly and testing market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial application industries.

Q5. Who are the key outsourced semiconductor assembly and testing companies?

Answer: Some of the key outsourced semiconductor assembly and testing companies are as follows:

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI (Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS

Q6. Which OSAT segment will be the largest in future?

Answer:Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.

Q7. In outsourced semiconductor assembly and testing market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1. What are some of the most promising, high-growth opportunities for the global outsourced semiconductor assembly and testing market by service type (assembly & packaging and testing), packaging type (wire bond, flip chip, wafer level, and others), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Outsourced Semiconductor Assembly and Testing Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Outsourced Semiconductor Assembly and Testing Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Outsourced Semiconductor Assembly and Testing Market by Service Type
    • 3.3.1: Assembly & Packaging
    • 3.3.2: Testing
  • 3.4: Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type
    • 3.4.1: Wire Bond
    • 3.4.2: Flip Chip
    • 3.4.3: Wafer Level
    • 3.4.4: Others
  • 3.5: Global Outsourced Semiconductor Assembly and Testing Market by Application
    • 3.5.1: Automotive
    • 3.5.2: Telecommunications
    • 3.5.3: Computing & Networking
    • 3.5.4: Consumer Electronics
    • 3.5.5: Industrial

4. Market Trends and Forecast Analysis by Region from 2017-2028

  • 4.1: Global Outsourced Semiconductor Assembly and Testing Market by Region
  • 4.2: North American Outsourced Semiconductor Assembly and Testing Market
    • 4.2.1: North American Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.2.2: North American Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.3: European Outsourced Semiconductor Assembly and Testing Market
    • 4.3.1: European Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.3.2: European Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.4: APAC Outsourced Semiconductor Assembly and Testing Market
    • 4.4.1: APAC Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.4.2: APAC Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.5: ROW Outsourced Semiconductor Assembly and Testing Market
    • 4.5.1: ROW Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.5.2: ROW Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Service Type
    • 6.1.2: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Packaging Type
    • 6.1.3: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Application
    • 6.1.5: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Region
  • 6.2: Emerging Trends in the Global Outsourced Semiconductor Assembly and Testing Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Outsourced Semiconductor Assembly and Testing Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Outsourced Semiconductor Assembly and Testing Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor
  • 7.2: Amkor
  • 7.3: Jiangsu Changjiang Electronics Technology
  • 7.4: Siliconware Precision Industries
  • 7.5: PTI (Powertech Technology Inc.)
  • 7.6: United test and assembly center
  • 7.7: King Yuan Electronics
  • 7.8: ChipMOS