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半導體生產設備

市場調查報告書

商品編碼

1510385

3D IC 市場規模、佔有率、成長分析（按類型、組件、應用、最終用戶、地區）- 產業預測，2024-2031 年

3D IC Market Size, Share, Growth Analysis, By Type, By Component(Through-Silicon Via, Through Glass Via, and Silicon Interposer), By Application, By End User, By Region - Industry Forecast 2024-2031

出版日期: 2024年07月05日 | 出版商:

SkyQuest | 英文 197 Pages | 商品交期: 3-5個工作天內

價格

簡介目錄

2022年3D IC市場規模將為132.5億美元，預測期內（2024-2031年）複合年成長率為20.10%，從2023年的159.1億美元增至2031年的688億美元，預計將成長至80美元百萬。

由於技術進步，特別是電子設備的小型化和高效化，3D IC 市場正在經歷快速成長。這種快速成長是由消費者對更小、更強大的電子設備（例如智慧型手機和平板電腦設備）的需求增加所推動的。基本上，3D IC 透過多層堆疊積體電路來提高能源效率、訊號強度和小型化。儘管潛力巨大，但該市場仍面臨許多挑戰，例如初始成本高、需要專用工具的複雜製造流程以及對溫度控管和標準化的擔憂。儘管如此，3D IC 的採用帶來了巨大的機遇，特別是隨著人工智慧、機器學習和 5G 技術的興起，這些技術需要更快的資料處理速度和緊湊外形規格的增強功能。隨著產業不斷創新並應對這些挑戰，3D IC 市場預計將在未來幾年實現顯著成長。

市場概況
北美洲
- 美國
- 加拿大
歐洲
- 德國
- 西班牙
- 法國
- 英國
- 義大利
- 其他歐洲國家地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 其他亞太地區
拉丁美洲
- 巴西
- 其他拉丁美洲地區
中東和非洲 (MEA)
- 海灣合作理事會國家
- 南非
- 其他中東/非洲地區

競爭格局

前5名企業對比
主要企業市場定位（2023年）
主要市場參與者所採取的策略
近期市集活動
主要企業市場佔有率（2023年）

主要企業簡介

Taiwan Semiconductor Manufacturing Company Limited（Taiwan）
Intel Corporation（United States）
Samsung Electronics Co., Ltd.（South Korea）
Advanced Micro Devices, Inc.（United States）
SK Hynix Inc.（South Korea）
Micron Technology, Inc.（United States）
GlobalFoundries Inc.（United States）
United Microelectronics Corporation（Taiwan）
Xilinx, Inc.（United States）
ASE Technology Holding Co., Ltd.（Taiwan）
Broadcom Inc.（United States）
Qualcomm Incorporated（United States）
Texas Instruments Incorporated（United States）
Nvidia Corporation（United States）
MediaTek Inc.（Taiwan）
Cadence Design Systems, Inc.（United States）
Marvell Technology Group Ltd.（Bermuda）
Renesas Electronics Corporation（Japan）
Synopsys, Inc.（United States）
STMicroelectronics NV（Switzerland）

簡介目錄

Product Code: SQMIG45K2097

3D IC Market size was valued at USD 13.25 Billion in 2022 and is poised to grow from USD 15.91 Billion in 2023 to USD 68.88 Billion by 2031, at a CAGR of 20.10% during the forecast period (2024-2031).

The 3D IC market is experiencing rapid growth driven by advancements in technology, particularly in the miniaturization and efficiency of electronic devices. This surge is fueled by increasing consumer demand for smaller yet more powerful electronics, such as smartphones and tablets. Essentially, 3D ICs involve stacking multiple layers of integrated circuits, enhancing energy efficiency, signal strength, and compactness. Despite its potential, the market faces challenges like high initial costs, complex manufacturing processes requiring specialized tools, and concerns over heat management and standardization. Nonetheless, the adoption of 3D ICs presents significant opportunities, particularly with the rise of AI, machine learning, and 5G technologies, which demand faster data processing and enhanced capabilities in compact form factors. As the industry continues to innovate and address these challenges, the 3D IC market is poised for substantial growth in the coming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the 3D IC Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

3D IC Market Segmental Analysis

Global 3D IC market is segmented based on type, component, application, end user, and region. Based on type, the market is segmented into Stacked 3D, and Monolithic 3D. Based on components, the market is segmented into Through-Silicon Via (TSV), Through Glass Via (TGV), and Silicon Interposer. Based on application, the market is segmented into Logic, Imaging & Optoelectronics, Memory, Sensors, LEDs, and Others. Based on end user, the market is segmented into Consumer Electronics, Industrial, Telecommunications, automotive, Military and Aerospace, and Medical Devices. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.

Drivers of the 3D IC Market

The 3D IC market is expanding significantly due to increasing demand for compact and high-speed electronic devices worldwide. As consumer preferences lean towards smaller, lighter, and more powerful gadgets such as smartphones, tablets, and wearables, 3D IC technology enables the stacking of multiple layers of integrated circuits. This approach enhances device performance, reduces power consumption, and facilitates miniaturization, effectively meeting evolving consumer demands for advanced electronics. The adoption of 3D IC technology not only improves device functionality but also aligns with the dynamic expectations of tech-savvy consumers seeking efficient and compact solutions in their electronic purchases.

Restraints in the 3D IC Market

The significant initial expenses associated with 3D IC technology pose a formidable obstacle to market adoption. The intricate manufacturing processes and requirement for specialized tools substantially inflate production costs, which can deter widespread adoption of this technology across various industries. The substantial upfront investment required may hinder many factories from integrating this innovative technology into their operations, limiting its broader application and potential impact.

Market Trends of the 3D IC Market

The 3D IC market is witnessing a significant trend towards increased adoption in artificial intelligence (AI) and machine learning (ML) applications. With the rising prevalence of these advanced technologies, there is a growing demand for faster data processing and enhanced performance capabilities. 3D IC technology emerges as a crucial solution to meet these requirements effectively. The trend underscores the growing significance of 3D ICs in both the development and utilization of AI and ML, thereby driving expansion within the market for this technology.

Introduction

Objectives of the Study
Definitions
Market Scope

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Market Overview Outlook
Supply Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers

Key Market Insights

Technology Analysis
Pricing Analysis
Value Chain Analysis
Ecosystem of the Market
Start-up Analysis
Regulatory Landscape
Innovation Matrix
Top Investment Analysis
Key Success Factor
Market Attractive Index
Degree of Competition

Global 3D IC Market by Type

Market Overview
Stacked 3D
Monolithic 3D

Global 3D IC Market by Component

Market Overview
Through-Silicon Via (TSV)
Through Glass Via (TGV)
Silicon Interposer

Global 3D IC Market by Application

Market Overview
Logic
Imaging and Optoelectronics
Memory
LEDs
Sensors
Others

Global 3D IC Market by End User

Market Overview
Consumer Electronics
Industrial
Telecommunications
Military and Aerospace
Automotive
Medical Devices

Global 3D IC Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Activities in the Market
Key Companies Market Share (%), 2023

Key Company Profiles

Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Micro Devices, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SK Hynix Inc. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Micron Technology, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
GlobalFoundries Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
United Microelectronics Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Xilinx, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Development
ASE Technology Holding Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Broadcom Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Qualcomm Incorporated (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Development
Texas Instruments Incorporated (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nvidia Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
MediaTek Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Cadence Design Systems, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Marvell Technology Group Ltd. (Bermuda)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Renesas Electronics Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Synopsys, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STMicroelectronics N.V. (Switzerland)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments