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1467760

2024-2032 年按類型、組件（矽通孔、玻璃通孔、矽中介層）、應用、最終用戶和地區分類的 3D IC 市場

3D IC Market by Type, Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), Application, End User, and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 137 Pages | 商品交期: 2-3個工作天內

價格

IMARC Group年全球3D IC市場規模達170億美元。筆記型電腦、智慧型手機和平板電腦等各種具有卓越功能的緊湊型和先進消費性電子產品的購買量不斷增加，是推動市場的主要因素。

3D（3D）積體電路（IC）是一個總稱，代表一種製造技術，涉及將不同的矽晶片、晶片和晶圓垂直堆疊或整合在一起。這些材料進一步組合成單一封裝，其中裝置透過矽通孔 (TSV) 和混合鍵合程式連接。它還包括 3D 晶圓級晶片級封裝 (WLCSP)、束重結晶、固相結晶和晶圓鍵合，作為堆疊過程中使用的標準技術。與2D (2D) IC 相比，3D IC 在類似的較小面積內以相同的降低功耗提供更高的速度、最小化的佔地面積和更好的功能密度。除此之外，它還提供更高的頻寬、靈活性和異質整合，確保更快的訊號轉換，並實現更好的電氣性能。因此，3D IC 作為微電子、光子學、邏輯成像、光電子和感測器等領域的關鍵組件得到了廣泛的應用。

3D IC 市場趨勢：

3D IC 在航空航太、汽車、通訊和電信等行業的廣泛使用是推動市場成長的關鍵因素之一。與此一致的是，由於擴大購買各種具有卓越功能的緊湊型和先進消費性電子產品（例如筆記型電腦、智慧型手機和平板電腦），電子產業的大幅擴張正在推動市場成長。此外，對具有最低功耗特性的先進電子架構和積體電路的需求不斷成長，也促進了市場的成長。在遊戲機和感測器等小型電子設備中整合 IC 和使用晶圓級封裝的新興趨勢進一步支持了這一點。此外，3D IC在智慧家庭設備中的廣泛應用，包括安全鎖、恆溫器、風扇控制器、智慧型煙霧偵測器、窗戶感測器和能源監視器，有利於市場成長。它們也被進一步嵌入到各種醫療保健設備中，例如小型助聽器、視覺輔助器以及心臟監視器。消費者對多種產品優勢的認知不斷提高，包括更快的速度、記憶體、耐用性、效率、效能和減少定時延遲，正在推動市場成長。此外，物聯網（IoT）和人工智慧（AI）解決方案與無線技術的整合以及製造商為提高產品產量而推出的先進IC封裝系統正在推動市場成長。其他因素，例如對高頻寬記憶體（HBM）的需求不斷成長和持續的產品多樣化，正在積極刺激市場成長。

本報告回答的關鍵問題：

  • 迄今為止，全球 3D IC 市場表現如何，未來幾年又將如何表現？
  • 全球3D IC市場的促進因素、限制因素和機會是什麼？
  • 主要區域市場有哪些？
  • 哪些國家代表了最具吸引力的 3D IC 市場？
  • 依類型分類市場是怎麼樣的？
  • 基於組件的市場區隔是什麼？
  • 基於應用程式的市場區隔是什麼？
  • 基於最終用戶的市場區隔是什麼？
  • 全球3D IC市場競爭格局如何？
  • 全球 3D IC 市場的主要參與者/公司有哪些？

目錄

第1章：前言

第 2 章：範圍與方法

  • 研究目的
  • 利害關係人
  • 資料來源
    • 主要資源
    • 二手資料
  • 市場預測
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第 3 章：執行摘要

第 4 章：簡介

  • 概述
  • 主要行業趨勢

第 5 章：全球 3D IC 市場

  • 市場概況
  • 市場業績
  • COVID-19 的影響
  • 市場預測

第 6 章：市場區隔：按類型

  • 堆疊 3D
    • 市場走向
    • 市場預測
  • 整體式 3D
    • 市場走向
    • 市場預測

第 7 章：市場區隔：按組成部分

  • 矽通孔 (TSV)
    • 市場走向
    • 市場預測
  • 玻璃通孔 (TGV)
    • 市場走向
    • 市場預測
  • 矽中介層
    • 市場走向
    • 市場預測

第 8 章：市場區隔：按應用

  • 邏輯
    • 市場走向
    • 市場預測
  • 成像與光電
    • 市場走向
    • 市場預測
  • 記憶
    • 市場走向
    • 市場預測
  • MEMS/感測器
    • 市場走向
    • 市場預測
  • 引領
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 9 章：市場區隔：按最終用戶

  • 消費性電子產品
    • 市場走向
    • 市場預測
  • 電信
    • 市場走向
    • 市場預測
  • 汽車
    • 市場走向
    • 市場預測
  • 軍事和航太
    • 市場走向
    • 市場預測
  • 醫療設備
    • 市場走向
    • 市場預測
  • 工業的
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 10 章：市場區隔：按地區

  • 北美洲
    • 美國
      • 市場走向
      • 市場預測
    • 加拿大
      • 市場走向
      • 市場預測
  • 亞太
    • 中國
      • 市場走向
      • 市場預測
    • 日本
      • 市場走向
      • 市場預測
    • 印度
      • 市場走向
      • 市場預測
    • 韓國
      • 市場走向
      • 市場預測
    • 澳洲
      • 市場走向
      • 市場預測
    • 印尼
      • 市場走向
      • 市場預測
    • 其他
      • 市場走向
      • 市場預測
  • 歐洲
    • 德國
      • 市場走向
      • 市場預測
    • 法國
      • 市場走向
      • 市場預測
    • 英國
      • 市場走向
      • 市場預測
    • 義大利
      • 市場走向
      • 市場預測
    • 西班牙
      • 市場走向
      • 市場預測
    • 俄羅斯
      • 市場走向
      • 市場預測
    • 其他
      • 市場走向
      • 市場預測
  • 拉丁美洲
    • 巴西
      • 市場走向
      • 市場預測
    • 墨西哥
      • 市場走向
      • 市場預測
    • 其他
      • 市場走向
      • 市場預測
  • 中東和非洲
    • 市場走向
    • 市場細分：按國家/地區
    • 市場預測

第 11 章：促進因素、限制與機會

  • 概述
  • 促進要素
  • 限制
  • 機會

第 12 章：價值鏈分析

第 13 章：波特五力分析

  • 概述
  • 買家的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第 14 章：價格分析

第15章：競爭格局

  • 市場結構
  • 關鍵參與者
  • 關鍵參與者簡介
    • Advanced Micro Devices Inc.
    • MonolithIC 3D Inc.
Product Code: SR112024A6723

The global 3D IC market size reached US$ 17.0 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 84.7 Billion by 2032, exhibiting a growth rate (CAGR) of 18.96% during 2024-2032. The increasing purchase of various compact and advanced consumer electronic products with superior functionality, such as laptops, smartphones, and tablets, represents the prime factor driving the market.

Three-dimensional (3D) integrated circuit (IC) refers to an umbrella term representing a manufacturing technology that involves stacking or integrating different silicon die, chips and wafers together vertically. These materials are further combined into a single package wherein the device is connected via silicon vias (TSVs) and hybrid bonding procedures. It also encompasses 3D wafer-level chip-scale packaging (WLCSP), beam re-crystallization, solid phase crystallization, and wafer bonding as standard technologies used in the stacking process. As compared to two-dimensional (2D) IC, 3D IC offers higher speed, minimized footprint, and better functional density at the same reduced power in a similar smaller area. Apart from this, it provides higher bandwidth, flexibility, and heterogeneous integration, ensures faster signal transitions, and enables better electrical performances. As a result, 3D IC finds extensive applications as a key component in microelectronics, photonics, logic imaging, optoelectronics, and sensors.

3D IC Market Trends:

The widespread utilization of 3D IC across industries, such as aerospace, automotive and communications and telecom, represents one of the key factors driving the market growth. In line with this, the considerable expansion in the electronics industry on account of the increasing purchase of various compact and advanced consumer electronics products with superior functionality, such as laptops, smartphones, and tablets, is driving the market growth. Moreover, the rising need for advanced electronics architecture and integrated circuits with minimal power consumption properties, is contributing to the market growth. This is further supported by the emerging trend of incorporating ICs and using wafer-level packaging in miniaturized electronic devices, such as gaming consoles and sensors. Additionally, the extensive incorporation of 3D IC in smart home devices, including security locks, thermostats, fan controllers, smart smoke detectors, window sensors, and energy monitors, is favoring the market growth. They are further embedded in diverse healthcare devices, such as small hearing and visual aids and heart monitors. The escalating consumer awareness regarding the multiple product benefits, including better speed, memory, durability, efficiency, performance, and reduced timing delays, is propelling the market growth. Furthermore, the integration of the Internet of Things (IoT) and artificial intelligence (AI) solutions with wireless technologies and the advent of advanced IC packaging systems by manufacturers to improve product production is impelling the market growth. Other factors, such as the fueling need for high-bandwidth memory (HBM) and ongoing product diversification, are positively stimulating the market growth.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global 3D IC market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, component, application and end user.

Type Insights:

Stacked 3D

Monolithic 3D

The report has also provided a detailed breakup and analysis of the 3D IC market based on the type. This includes stacked and monolithic 3D. According to the report, stacked 3D represented the largest segment.

Component Insights:

Through-Silicon Via (TSV)

Through Glass Via (TGV)

Silicon Interposer

A detailed breakup and analysis of the 3D IC market based on the component has also been provided in the report. This includes through-silicon via (TSV), through glass via (TGV) and silicon interposer. According to the report, through-silicon via (TSV) accounted for the largest market share.

Application Insights:

Logic

Imaging and Optoelectronics

Memory

MEMS/Sensors

LED

Others

The report has also provided a detailed breakup and analysis of the 3D IC market based on the application. This includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, and others. According to the report, MEMS/sensors represented the largest segment.

End User Insights:

Consumer Electronics

Telecommunication

Automotive

Military and Aerospace

Medical Devices

Industrial

Others

A detailed breakup and analysis of the 3D IC market based on the end user has also been provided in the report. This includes consumer electronics, telecommunication, automotive, military and aerospace, medical devices, industrial and others. According to the report, consumer electronics accounted for the largest market share.

Regional Insights:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and the Middle East and Africa. According to the report, Asia Pacific was the largest market for 3D IC. Some of the factors driving the Asia Pacific 3D IC market included its rapid expansion in the electronics sector and the increasing purchase of compact consumer electronic products with superior functionality.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global 3D IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro Devices Inc., MonolithIC 3D Inc., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

  • How has the global 3D IC market performed so far and how will it perform in the coming years?
  • What are the drivers, restraints, and opportunities in the global 3D IC market?
  • What are the key regional markets?
  • Which countries represent the most attractive 3D IC markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the component?
  • What is the breakup of the market based on the application?
  • What is the breakup of the market based on the end user?
  • What is the competitive structure of the global 3D IC market?
  • Who are the key players/companies in the global 3D IC market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global 3D IC Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Stacked 3D
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Monolithic 3D
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Component

  • 7.1 Through-Silicon Via (TSV)
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Through Glass Via (TGV)
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Silicon Interposer
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast

8 Market Breakup by Application

  • 8.1 Logic
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Imaging and Optoelectronics
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Memory
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 MEMS/Sensors
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 LED
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 Others
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast

9 Market Breakup by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Market Trends
    • 9.1.2 Market Forecast
  • 9.2 Telecommunication
    • 9.2.1 Market Trends
    • 9.2.2 Market Forecast
  • 9.3 Automotive
    • 9.3.1 Market Trends
    • 9.3.2 Market Forecast
  • 9.4 Military and Aerospace
    • 9.4.1 Market Trends
    • 9.4.2 Market Forecast
  • 9.5 Medical Devices
    • 9.5.1 Market Trends
    • 9.5.2 Market Forecast
  • 9.6 Industrial
    • 9.6.1 Market Trends
    • 9.6.2 Market Forecast
  • 9.7 Others
    • 9.7.1 Market Trends
    • 9.7.2 Market Forecast

10 Market Breakup by Region

  • 10.1 North America
    • 10.1.1 United States
      • 10.1.1.1 Market Trends
      • 10.1.1.2 Market Forecast
    • 10.1.2 Canada
      • 10.1.2.1 Market Trends
      • 10.1.2.2 Market Forecast
  • 10.2 Asia-Pacific
    • 10.2.1 China
      • 10.2.1.1 Market Trends
      • 10.2.1.2 Market Forecast
    • 10.2.2 Japan
      • 10.2.2.1 Market Trends
      • 10.2.2.2 Market Forecast
    • 10.2.3 India
      • 10.2.3.1 Market Trends
      • 10.2.3.2 Market Forecast
    • 10.2.4 South Korea
      • 10.2.4.1 Market Trends
      • 10.2.4.2 Market Forecast
    • 10.2.5 Australia
      • 10.2.5.1 Market Trends
      • 10.2.5.2 Market Forecast
    • 10.2.6 Indonesia
      • 10.2.6.1 Market Trends
      • 10.2.6.2 Market Forecast
    • 10.2.7 Others
      • 10.2.7.1 Market Trends
      • 10.2.7.2 Market Forecast
  • 10.3 Europe
    • 10.3.1 Germany
      • 10.3.1.1 Market Trends
      • 10.3.1.2 Market Forecast
    • 10.3.2 France
      • 10.3.2.1 Market Trends
      • 10.3.2.2 Market Forecast
    • 10.3.3 United Kingdom
      • 10.3.3.1 Market Trends
      • 10.3.3.2 Market Forecast
    • 10.3.4 Italy
      • 10.3.4.1 Market Trends
      • 10.3.4.2 Market Forecast
    • 10.3.5 Spain
      • 10.3.5.1 Market Trends
      • 10.3.5.2 Market Forecast
    • 10.3.6 Russia
      • 10.3.6.1 Market Trends
      • 10.3.6.2 Market Forecast
    • 10.3.7 Others
      • 10.3.7.1 Market Trends
      • 10.3.7.2 Market Forecast
  • 10.4 Latin America
    • 10.4.1 Brazil
      • 10.4.1.1 Market Trends
      • 10.4.1.2 Market Forecast
    • 10.4.2 Mexico
      • 10.4.2.1 Market Trends
      • 10.4.2.2 Market Forecast
    • 10.4.3 Others
      • 10.4.3.1 Market Trends
      • 10.4.3.2 Market Forecast
  • 10.5 Middle East and Africa
    • 10.5.1 Market Trends
    • 10.5.2 Market Breakup by Country
    • 10.5.3 Market Forecast

11 Drivers, Restraints, and Opportunities

  • 11.1 Overview
  • 11.2 Drivers
  • 11.3 Restraints
  • 11.4 Opportunities

12 Value Chain Analysis

13 Porters Five Forces Analysis

  • 13.1 Overview
  • 13.2 Bargaining Power of Buyers
  • 13.3 Bargaining Power of Suppliers
  • 13.4 Degree of Competition
  • 13.5 Threat of New Entrants
  • 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

  • 15.1 Market Structure
  • 15.2 Key Players
  • 15.3 Profiles of Key Players
    • 15.3.1 Advanced Micro Devices Inc.
      • 15.3.1.1 Company Overview
      • 15.3.1.2 Product Portfolio
      • 15.3.1.3 SWOT Analysis
    • 15.3.2 MonolithIC 3D Inc.
      • 15.3.2.1 Company Overview
      • 15.3.2.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

  • Figure 1: Global: 3D IC Market: Major Drivers and Challenges
  • Figure 2: Global: 3D IC Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: 3D IC Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: 3D IC Market: Breakup by Type (in %), 2023
  • Figure 5: Global: 3D IC Market: Breakup by Component (in %), 2023
  • Figure 6: Global: 3D IC Market: Breakup by Application (in %), 2023
  • Figure 7: Global: 3D IC Market: Breakup by End User (in %), 2023
  • Figure 8: Global: 3D IC Market: Breakup by Region (in %), 2023
  • Figure 9: Global: 3D IC (Stacked 3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: 3D IC (Stacked 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: 3D IC (Monolithic 3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: 3D IC (Monolithic 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: 3D IC (Through-Silicon Via (TSV)) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: 3D IC (Through-Silicon Via (TSV)) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: 3D IC (Through Glass Via (TGV)) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: 3D IC (Through Glass Via (TGV)) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: 3D IC (Silicon Interposer) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: 3D IC (Silicon Interposer) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: 3D IC (Logic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: 3D IC (Logic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: 3D IC (Imaging and Optoelectronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: 3D IC (Imaging and Optoelectronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: 3D IC (Memory) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: 3D IC (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: 3D IC (MEMS/Sensors) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: 3D IC (MEMS/Sensors) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: 3D IC (LED) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: 3D IC (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Global: 3D IC (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Global: 3D IC (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: Global: 3D IC (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: Global: 3D IC (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: Global: 3D IC (Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: Global: 3D IC (Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Global: 3D IC (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Global: 3D IC (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Global: 3D IC (Military and Aerospace) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Global: 3D IC (Military and Aerospace) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Global: 3D IC (Medical Devices) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Global: 3D IC (Medical Devices) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Global: 3D IC (Industrial) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Global: 3D IC (Industrial) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Global: 3D IC (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Global: 3D IC (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: North America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: North America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United States: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United States: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Canada: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Canada: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Asia-Pacific: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Asia-Pacific: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: China: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: China: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Japan: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Japan: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: India: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: India: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: South Korea: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: South Korea: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Australia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Australia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Indonesia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Indonesia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Europe: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Europe: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 69: Germany: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 70: Germany: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 71: France: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 72: France: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 73: United Kingdom: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 74: United Kingdom: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: Italy: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: Italy: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 77: Spain: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 78: Spain: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 79: Russia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 80: Russia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 81: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 82: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 83: Latin America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 84: Latin America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Brazil: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 86: Brazil: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 87: Mexico: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 88: Mexico: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 89: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 90: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 91: Middle East and Africa: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 92: Middle East and Africa: 3D IC Market: Breakup by Country (in %), 2023
  • Figure 93: Middle East and Africa: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 94: Global: 3D IC Industry: Drivers, Restraints, and Opportunities
  • Figure 95: Global: 3D IC Industry: Value Chain Analysis
  • Figure 96: Global: 3D IC Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: 3D IC Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: 3D IC Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: 3D IC Market Forecast: Breakup by Component (in Million US$), 2024-2032
  • Table 4: Global: 3D IC Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 5: Global: 3D IC Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 6: Global: 3D IC Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 7: Global: 3D IC Market: Competitive Structure
  • Table 8: Global: 3D IC Market: Key Player