全球先進封裝市場規模、佔有率和成長分析：按類型和最終用途 - 產業預測（2024-2031）

Global Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031

出版日期: 2024年03月01日 | 出版商:

SkyQuest | 英文 184 Pages | 商品交期: 3-5個工作天內

價格

簡介目錄

2022年全球先進封裝市場規模將達到306億美元，從2023年的330億美元成長到2031年的603.6億美元。複合年成長率為7.84%。

先進封裝為矽晶圓、邏輯單元和記憶體提供免受物理損壞和腐蝕的保護機殼，同時也為 2.5D、3D-IC 和扇出晶圓提供保護，在半導體製造的最後階段發揮關鍵作用水平封裝、系統級封裝晶圓層次電子構裝促進了晶片與電路基板之間的連接。在智慧型手機、物聯網設備和高階產品需求激增的推動下，先進封裝（特別是扇出晶圓層次電子構裝）市場正在迅速擴大，行業供應商正在開發具有成本效益的製程以提高業務效率。迫於壓力才這樣做。目前，先進封裝在滿足各種積體電路（IC）多樣化的封裝需求方面具有巨大潛力，由於營運成本較高，這些積體電路主要用於高階和利基市場應用，並提供了超越傳統封裝方法的成長機會。先進封裝的能力預計將超越傳統封裝解決方案，並有望在未來幾年推動有利的市場趨勢和該領域的進一步發展。

市場概況
北美洲
- 美國
- 加拿大
歐洲
- 德國
- 西班牙
- 法國
- 英國
- 其他歐洲國家地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 其他亞太地區
拉丁美洲
- 巴西
- 其他拉丁美洲地區
中東和非洲 (MEA)
- 海灣合作理事會國家
- 南非
- 其他中東/非洲地區

競爭格局

前5名企業對比
主要企業市場定位（2021年）
主要市場參與者所採取的策略
關鍵成功策略
近期市集活動
主要企業市場佔有率（2021年）

主要企業簡介

Intel Corporation（United States）
Advanced Micro Devices（AMD）（United States）
Taiwan Semiconductor Manufacturing Company（TSMC）（Taiwan）
Samsung Electronics（South Korea）
ASE Group（Taiwan）
Amkor Technology（United States）
JCET Group（China）
Powertech Technology（Taiwan）
Siliconware Precision Industries Co., Ltd.（SPIL）（Taiwan）
ChipMOS Technologies Inc.（Taiwan）
UTAC Holdings Ltd.（Singapore）
Tokyo Electron Limited（Japan）
SCHOTT AG（Germany）
Palomar Technologies（United States）
Rudolph Technologies（United States）
BESI Group（Netherlands）
STATS ChipPAC Ltd.（Singapore）

簡介目錄

Product Code: SQMIG15H2036

Global Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).

Advanced packaging plays a crucial role as a protective enclosure safeguarding silicon wafers, logic units, and memory from physical damage and corrosion during semiconductor manufacturing's final stage, while also facilitating chip connection to circuit boards through innovative techniques like 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package. The market for advanced packaging, particularly fan-out wafer level packaging, has experienced rapid expansion driven by the surging demand for smartphones, IoT devices, and high-end products, prompting industry suppliers to develop cost-effective processes for improved operational efficiency. Despite currently being predominantly utilized for high-end and niche-market applications due to higher operational costs, advanced packaging holds significant potential for accommodating the diverse packaging needs of various integrated circuits (ICs), offering growth opportunities that surpass traditional packaging methods. With expectations to surpass conventional packaging solutions in capabilities, advanced packaging is poised to foster lucrative market trends and further advancements in the field in the forthcoming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Advanced Packaging Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Advanced Packaging Market Segmental Analysis

The Global Advanced Packaging Market is segmented on the basis of Type, End - Use, and Region. By Type the market is segmented into Flip Chip CSP, Flip-Chip Ball Grid Array. By End - User, the market is segmented into Consumer Electronics, Automotive. By Region, the market is segmented into North America, Europe, Latin America, Asia- Pacific, Middle East and Africa.

Drivers of the Global Advanced Packaging Market

In today's electronics landscape, the ongoing push for miniaturization underscores the vital role of advanced packaging methods. These techniques are indispensable for seamlessly integrating numerous components into a singular package, thereby enhancing the device's performance and functionality on a comprehensive scale.

Restraints in the Global Advanced Packaging Market

Intellectual property issues, coupled with the absence of uniform advanced packaging solutions, can introduce uncertainties and impede market expansion by deterring companies from committing to proprietary technologies.

Market Trends of the Global Advanced Packaging Market

Fan-Out Wafer-Level Packaging (FOWLP) has surged in popularity thanks to its capacity for producing thinner, more economical packages, rendering it an appealing option for mobile devices and high-performance applications.

Executive Summary

Market Overview
Wheel of Fortune

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Parent Market Analysis

Market Overview
Market Size
Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges

Key Market Insights

Technology Analysis
Pricing Analysis
Supply Chain Analysis
Value Chain Analysis
Ecosystem of the Market
IP Analysis
Trade Analysis
Startup Analysis
Raw Material Analysis
Innovation Matrix
Pipeline Product Analysis
Macroeconomic Indicators
Top Investment Analysis
Key Success Factor
Degree of Competition

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Regulatory Landscape
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers
Skyquest Special Insights on Future Disruptions
- Political Impact
- Economic Impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact

Global Advanced Packaging Market by Type

Market Overview
Flip Chip CSP
and Flip-Chip Ball Grid Array

Global Advanced Packaging Market by End-Use

Market Overview
Consumer Electronics
and Automotive

Global Advanced Packaging Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2021
Strategies Adopted by Key Market Players
Top Winning Strategies
- By Development
- By Company
- By Year
Recent Activities in the Market
Key Companies Market Share (%), 2021

Key Company Profiles

Intel Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Micro Devices (AMD) (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Amkor Technology (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
JCET Group (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Powertech Technology (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ChipMOS Technologies Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
UTAC Holdings Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Tokyo Electron Limited (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SCHOTT AG (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Palomar Technologies (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Rudolph Technologies (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
BESI Group (Netherlands)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STATS ChipPAC Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments