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1577174

先進半導體封裝市場預測至 2030 年：按封裝類型、裝置類型、材料類型、技術、應用、最終用戶和地區進行的全球分析

Advanced Semiconductor Packaging Market Forecasts to 2030 - Global Analysis By Packaging Type, Device Type, Material Type, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC預測，2024年全球先進半導體封裝市場規模將達345億美元，預計2030年將達到524億美元，預測期內複合年成長率為7.2%。

先進半導體封裝包括旨在透過創新封裝解決方案提高積體電路性能和效率的最尖端科技。這包括 3D 堆疊、系統級封裝(SiP) 和小晶片架構等技術，以實現進一步小型化和改進溫度控管。透過最佳化半導體元件的佈局和連接，先進封裝可實現更快的資料傳輸和更低的功耗。

電子設備的需求增加

隨著消費性電子產品、物聯網設備和汽車技術變得更加複雜和功能豐富，對高效能、高效能封裝解決方案的需求正在迅速增加。先進的封裝技術能夠以較小的外形規格實現更強大的功能，並支援小型化和能源效率等趨勢。此外，人工智慧和5G連接的興起也進一步推動了這項需求。這些技術需要高度整合和強大的性能，進一步加速市場擴張。

整合的複雜性

半導體設計日益複雜，增加了缺陷的可能性，增加了故障率，並降低了產量比率。此外，複雜的互連和依賴性使製造過程變得複雜，增加了生產時間和成本。這種複雜性也使得難以確保可靠性和溫度控管，從而阻礙電子設備的整體性能並限制產業創新。

技術進步

3D 封裝、小晶片架構和扇出晶圓級封裝等創新可提高效能，同時縮小尺寸和功耗。穿透矽通孔(TSV) 和先進溫度控管解決方案等技術可改善連接性和散熱性。這些進步不僅可以提高整合密度和更快的資料傳輸速率，還可以支援人工智慧、5G 和物聯網 (IoT) 設備等新應用，從而推動產業成長。

製造成本高

市場上的高製造成本會嚴重阻礙產業成長和創新。隨著包裝技術變得更加複雜，與材料、設備和技術純熟勞工相關的成本也變得越來越複雜。這些財務負擔導致製造商利潤率下降，並限制他們投資研發的能力。此外，成本上升可能會阻礙先進封裝解決方案的採用，並減緩各領域的技術進步。

COVID-19 的影響：

COVID-19 大流行對市場產生了重大影響，擾亂了供應鏈並導致製造延誤。封鎖和監管措施導致生產設施暫時停止，導致零件嚴重短缺。由於遠距工作和數位轉型，對電子產品的需求增加進一步加劇了市場壓力。雖然疫情凸顯了先進封裝對於高效、緊湊設備的重要性，但它也暴露了全球供應網路的脆弱性，迫使企業重新考慮籌資策略並建立更具彈性的系統來鼓勵投資。

預計有機基板部分在預測期內將是最大的

預計有機基板部分在預測期內將佔據最大的市場佔有率。這些基板具有多種優點，包括輕質特性和與各種製造流程的兼容性。它還支援複雜的電路設計並支援現代電子產品所必需的高密度互連。此外，有機基板還有助於提高熱性能和可靠性，使其成為消費電子、通訊和汽車行業等應用的理想選擇。

預計影像感測器領域在預測期內的複合年成長率最高。

預計影像感測器領域在預測期內複合年成長率最高。這些感測器需要先進的封裝解決方案來提高性能、提高整合度並最大限度地減小尺寸，同時保持影像品質。隨著智慧型手機、汽車和安全系統等應用需求的不斷增加，對影像感測器的有效溫度控管和保護的關注至關重要，這將進一步推動半導體封裝的進步。

佔比最大的地區：

北美地區專注於技術創新和研究，預計在預測期內將佔據最大的市場佔有率。此外，旨在加強國內製造能力和減少供應鏈脆弱性的政府措施正在為半導體封裝的進步創造有利的環境，使該地區成為全球事務的主要參與者。

複合年成長率最高的地區：

在消費電子和汽車等各行業強勁需求的推動下，預計亞太地區在預測期內將實現最高成長率。消費性電子產品採用的快速成長和通訊技術的進步正在推動對先進封裝解決方案的需求。旨在提高國內製造能力和吸引外國投資的各種政府政策進一步增強了市場活力。

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目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球先進半導體封裝市場：依封裝類型

  • QR 圖封裝
  • 3D包裝
  • 系統級封裝(SiP)
  • 扇出晶圓級封裝 (FOWLP)
  • 覆晶封裝
  • 其他封裝類型

第6章全球先進半導體封裝市場：按元件類型

  • 邏輯裝置
  • 儲存裝置
  • 功率元件

第7章全球先進半導體封裝市場：依材料類型

  • 矽
  • 有機基材物
  • 陶瓷製品
  • 玻璃
  • 其他材料類型

第8章全球先進半導體封裝市場：依技術分類

  • 晶圓級封裝 (WLP)
  • 多晶片封裝 (MCP)
  • 穿透矽通孔(TSV)

第9章全球先進半導體封裝市場：依應用分類

  • 處理器
  • 圖形處理單元（GPU）
  • 動態隨機存取記憶體 (DRAM)
  • NAND快閃記憶體
  • 影像感測器
  • 其他用途

第10章全球先進半導體封裝市場：依最終用戶分類

  • 通訊
  • 車
  • 航太和國防
  • 醫療設備
  • 家電
  • 其他最終用戶

第11章全球先進半導體封裝市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第12章 主要進展

  • 合約、夥伴關係、合作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第13章 公司概況

  • Samsung Electronics
  • Intel Corporation
  • Qualcomm Technologies Inc.
  • IBM
  • Microchip Technology
  • Renesas Electronics Corporation
  • Texas Instruments
  • Analog Devices
  • STMicroelectronics
  • Infineon Technologies AG
  • Avery Dennison Corporation
  • Sumitomo Chemical Co., Ltd.
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Ltd.
  • NVIDIA Corporation
  • LG Chem
Product Code: SMRC27491

According to Stratistics MRC, the Global Advanced Semiconductor Packaging Market is accounted for $34.5 billion in 2024 and is expected to reach $52.4 billion by 2030 growing at a CAGR of 7.2% during the forecast period. Advanced Semiconductor Packaging involves cutting-edge techniques designed to enhance the performance and efficiency of integrated circuits through innovative packaging solutions. This includes methods like 3D stacking, system-in-package (SiP), and chiplet architectures, enabling greater miniaturization and improved thermal management. By optimizing the arrangement and connections of semiconductor components, advanced packaging achieves faster data transfer and lower power consumption.

Market Dynamics:

Driver:

Increased demand for electronics

As consumer electronics, IoT devices, and automotive technologies become more complex and feature-rich, the need for efficient, high-performance packaging solutions has surged. Advanced packaging techniques enable greater functionality in smaller form factors, catering to trends like miniaturization and energy efficiency. Additionally, the rise of artificial intelligence and 5G connectivity further propels this demand, as these technologies require advanced integration and robust performance, reinforcing the market's expansion.

Restraint:

Complexity of integration

Increasing complexity in semiconductor designs raises the possibility of flaws, which raises failure rates and lowers yield. Moreover, the intricate interconnections and dependencies can complicate the manufacturing process, resulting in longer production times and elevated costs. This complexity also makes it difficult to ensure reliability and thermal management, potentially hindering the overall performance of electronic devices and limiting innovation in the industry.

Opportunity:

Technological advancements

Innovations such as 3D packaging, chiplet architectures, and fan-out wafer-level packaging enhance performance while reducing size and power consumption. Techniques like through-silicon vias (TSVs) and advanced thermal management solutions improve connectivity and heat dissipation. These advancements not only enable higher integration density and faster data transfer rates but also support emerging applications in artificial intelligence, 5G, and Internet of Things (IoT) devices, driving industry growth.

Threat:

High manufacturing costs

High manufacturing costs in the market can significantly hinder industry growth and innovation. As the complexity of packaging technologies increases, so do the expenses associated with materials, equipment, and skilled labor. This financial burden can lead to reduced profit margins for manufacturers, limiting their ability to invest in research and development. Additionally, elevated costs can impede the widespread adoption of advanced packaging solutions, slowing down technological advancements across various sectors.

Covid-19 Impact:

The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in manufacturing. Lockdowns and restrictions led to a temporary shutdown of production facilities, exacerbating component shortages. Increased demand for electronics driven by remote work and digital transformation-further strained the market. While the pandemic highlighted the importance of advanced packaging for efficient and compact devices, it also exposed vulnerabilities in global supply networks, prompting companies to rethink sourcing strategies and invest in more resilient systems.

The organic substrates segment is projected to be the largest during the forecast period

The organic substrates segment is projected to account for the largest market share during the projection period. These substrates offer several advantages, including lightweight properties, compatibility with various fabrication processes. They enable intricate circuit designs and support high-density interconnections, essential for modern electronics. Additionally, organic substrates contribute to improved thermal performance and reliability, making them ideal for applications in consumer electronics, telecommunications, and automotive industries.

The image sensors segment is expected to have the highest CAGR during the forecast period

The image sensors segment is expected to have the highest CAGR during the extrapolated period. These sensors require advanced packaging solutions to enhance performance, improve integration, and minimize size while maintaining image quality. With rising demand in applications such as smartphones, automotive, and security systems, the focus on effective thermal management and protection for image sensors is essential, further propelling advancements in semiconductor packaging.

Region with largest share:

North America region is projected to account for the largest market share during the forecast period fueled by the region's strong emphasis on technological innovation and research. Additionally, government initiatives aimed at strengthening domestic manufacturing capabilities and reducing supply chain vulnerabilities are fostering a favorable environment for advancements in semiconductor packaging, positioning the region as a key player in the global landscape.

Region with highest CAGR:

Asia Pacific is expected to register the highest growth rate over the forecast period driven by robust demand from various sectors including consumer electronics, automotive. The surge in consumer electronics adoption and advancements in telecommunications technologies are fueling the demand for advanced packaging solutions. Various government policies aimed at boosting local manufacturing capabilities and attracting foreign investments are further enhancing market dynamics.

Key players in the market

Some of the key players in Advanced Semiconductor Packaging market include Samsung Electronics, Intel Corporation, Qualcomm Technologies Inc., IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog Devices, STMicroelectronics, Infineon Technologies AG, Avery Dennison Corporation, Sumitomo Chemical Co., Ltd., Powertech Technology Inc.Fujitsu Semiconductor Ltd., NVIDIA Corporation and LG Chem.

Key Developments:

In August 2024, Veeco Instruments Inc. announced that IBM selected the WaferStorm(R) Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.

In June 2024, Rapidus Corporation and IBM announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.

Packaging Types Covered:

  • 2D Packaging
  • 3D Packaging
  • System-in-Package (SiP)
  • Fan-Out Wafer-Level Packaging (FOWLP)
  • Flip Chip Packaging
  • Other Packaging Types

Device Types Covered:

  • Logic Devices
  • Memory Devices
  • Power Devices

Material Types Covered:

  • Silicon
  • Organic Substrates
  • Ceramic
  • Glass
  • Other Material Types

Technologies Covered:

  • Wafer-Level Packaging (WLP)
  • Multi-Chip Packages (MCP)
  • Through-Silicon Via (TSV)

Applications Covered:

  • Processor
  • Graphical Processing Units (GPUs)
  • Dynamic Random Access Memory (DRAM)
  • NAND Flash Memory
  • Image Sensors
  • Other Applications

End Users Covered:

  • Telecommunications
  • Automotive
  • Aerospace and Defense
  • Medical Devices
  • Consumer Electronics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Semiconductor Packaging Market, By Packaging Type

  • 5.1 Introduction
  • 5.2 2D Packaging
  • 5.3 3D Packaging
  • 5.4 System-in-Package (SiP)
  • 5.5 Fan-Out Wafer-Level Packaging (FOWLP)
  • 5.6 Flip Chip Packaging
  • 5.7 Other Packaging Types

6 Global Advanced Semiconductor Packaging Market, By Device Type

  • 6.1 Introduction
  • 6.2 Logic Devices
  • 6.3 Memory Devices
  • 6.4 Power Devices

7 Global Advanced Semiconductor Packaging Market, By Material Type

  • 7.1 Introduction
  • 7.2 Silicon
  • 7.3 Organic Substrates
  • 7.4 Ceramic
  • 7.5 Glass
  • 7.6 Other Material Types

8 Global Advanced Semiconductor Packaging Market, By Technology

  • 8.1 Introduction
  • 8.2 Wafer-Level Packaging (WLP)
  • 8.3 Multi-Chip Packages (MCP)
  • 8.4 Through-Silicon Via (TSV)

9 Global Advanced Semiconductor Packaging Market, By Application

  • 9.1 Introduction
  • 9.2 Processor
  • 9.3 Graphical Processing Units (GPUs)
  • 9.4 Dynamic Random Access Memory (DRAM)
  • 9.5 NAND Flash Memory
  • 9.6 Image Sensors
  • 9.7 Other Applications

10 Global Advanced Semiconductor Packaging Market, By End User

  • 10.1 Introduction
  • 10.2 Telecommunications
  • 10.3 Automotive
  • 10.4 Aerospace and Defense
  • 10.5 Medical Devices
  • 10.6 Consumer Electronics
  • 10.7 Other End Users

11 Global Advanced Semiconductor Packaging Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Samsung Electronics
  • 13.2 Intel Corporation
  • 13.3 Qualcomm Technologies Inc.
  • 13.4 IBM
  • 13.5 Microchip Technology
  • 13.6 Renesas Electronics Corporation
  • 13.7 Texas Instruments
  • 13.8 Analog Devices
  • 13.9 STMicroelectronics
  • 13.10 Infineon Technologies AG
  • 13.11 Avery Dennison Corporation
  • 13.12 Sumitomo Chemical Co., Ltd.
  • 13.13 Powertech Technology Inc.
  • 13.14 Fujitsu Semiconductor Ltd.
  • 13.15 NVIDIA Corporation
  • 13.16 LG Chem

List of Tables

  • Table 1 Global Advanced Semiconductor Packaging Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Advanced Semiconductor Packaging Market Outlook, By Packaging Type (2022-2030) ($MN)
  • Table 3 Global Advanced Semiconductor Packaging Market Outlook, By 2D Packaging (2022-2030) ($MN)
  • Table 4 Global Advanced Semiconductor Packaging Market Outlook, By 3D Packaging (2022-2030) ($MN)
  • Table 5 Global Advanced Semiconductor Packaging Market Outlook, By System-in-Package (SiP) (2022-2030) ($MN)
  • Table 6 Global Advanced Semiconductor Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2022-2030) ($MN)
  • Table 7 Global Advanced Semiconductor Packaging Market Outlook, By Flip Chip Packaging (2022-2030) ($MN)
  • Table 8 Global Advanced Semiconductor Packaging Market Outlook, By Other Packaging Types (2022-2030) ($MN)
  • Table 9 Global Advanced Semiconductor Packaging Market Outlook, By Device Type (2022-2030) ($MN)
  • Table 10 Global Advanced Semiconductor Packaging Market Outlook, By Logic Devices (2022-2030) ($MN)
  • Table 11 Global Advanced Semiconductor Packaging Market Outlook, By Memory Devices (2022-2030) ($MN)
  • Table 12 Global Advanced Semiconductor Packaging Market Outlook, By Power Devices (2022-2030) ($MN)
  • Table 13 Global Advanced Semiconductor Packaging Market Outlook, By Material Type (2022-2030) ($MN)
  • Table 14 Global Advanced Semiconductor Packaging Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 15 Global Advanced Semiconductor Packaging Market Outlook, By Organic Substrates (2022-2030) ($MN)
  • Table 16 Global Advanced Semiconductor Packaging Market Outlook, By Ceramic (2022-2030) ($MN)
  • Table 17 Global Advanced Semiconductor Packaging Market Outlook, By Glass (2022-2030) ($MN)
  • Table 18 Global Advanced Semiconductor Packaging Market Outlook, By Other Material Types (2022-2030) ($MN)
  • Table 19 Global Advanced Semiconductor Packaging Market Outlook, By Technology (2022-2030) ($MN)
  • Table 20 Global Advanced Semiconductor Packaging Market Outlook, By Wafer-Level Packaging (WLP) (2022-2030) ($MN)
  • Table 21 Global Advanced Semiconductor Packaging Market Outlook, By Multi-Chip Packages (MCP) (2022-2030) ($MN)
  • Table 22 Global Advanced Semiconductor Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 23 Global Advanced Semiconductor Packaging Market Outlook, By Application (2022-2030) ($MN)
  • Table 24 Global Advanced Semiconductor Packaging Market Outlook, By Processor (2022-2030) ($MN)
  • Table 25 Global Advanced Semiconductor Packaging Market Outlook, By Graphical Processing Units (GPUs) (2022-2030) ($MN)
  • Table 26 Global Advanced Semiconductor Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) (2022-2030) ($MN)
  • Table 27 Global Advanced Semiconductor Packaging Market Outlook, By NAND Flash Memory (2022-2030) ($MN)
  • Table 28 Global Advanced Semiconductor Packaging Market Outlook, By Image Sensors (2022-2030) ($MN)
  • Table 29 Global Advanced Semiconductor Packaging Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 30 Global Advanced Semiconductor Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 31 Global Advanced Semiconductor Packaging Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 32 Global Advanced Semiconductor Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 33 Global Advanced Semiconductor Packaging Market Outlook, By Aerospace and Defense (2022-2030) ($MN)
  • Table 34 Global Advanced Semiconductor Packaging Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 35 Global Advanced Semiconductor Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 36 Global Advanced Semiconductor Packaging Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.