FE·先進封裝金屬化學品市場:2024年～2025年(Critical Materials Report)

Metal Chemicals for FE & Advanced Packaging Market Report 2024-2025 (Critical Materials Report)

出版日期: 2024年10月10日 | 出版商:

TECHCET | 英文 | 商品交期: 最快1-2個工作天內

價格

簡介目錄圖表

本報告調查了FE/先進封裝的金屬化學品市場，並提供了應用於先進封裝（晶圓級）和半導體裝置製造（鑲嵌製程）的金屬化學品市場的趨勢和供應鏈信息，內容非常全面。銅電鍍和添加劑趨勢、市場佔有率、技術趨勢和供應商概況。附錄中還包括供應商產品比較圖，總結了先進封裝中使用的電鍍產品的公開資訊。

資訊圖表

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

INFOGRAPHICS

1 EXECUTIVE SUMMARY

1.1 EXECUTIVE SUMMARY
1.2 ADVANCED PACKAGING PER WAFER STARTS
1.3 DEVICE DEMAND DRIVERS - LOGIC
1.4 CU PLATING FORECAST FOR CU INTERCONNECTS AND ADVANCED PACKAGING
1.5 MARKET SHARES
1.6 SUPPLIER ACTIVITIES - VARIOUS ANNOUNCEMENTS
1.7 RISK FACTORS
1.8 ANALYST ASSESSMENT

2 SCOPE, PURPOSE AND METHODOLOGY

2.1 SCOPE
2.2 PURPOSE & METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMR REPORTS

3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK

3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK
- 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
- 3.1.2 SEMICONDUCTOR SALES GROWTH
- 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
- 3.2.1 ELECTRONICS OUTLOOK
- 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK
- 3.2.3 SMARTPHONE OUTLOOK
- 3.2.4 PC OUTLOOK
- 3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
- 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
- 3.3.2 NEW FABS IN THE US
- 3.3.3 WW FAB EXPANSION DRIVING GROWTH
- 3.3.4 EQUIPMENT SPENDING TRENDS
- 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
- 3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
- 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
- 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028

4 METAL CHEMICALS MARKET BY SEGMENT

4.1 DEFINITIONS
4.2 METAL PLATING CHEMICALS MARKET OVERVIEW
- 4.2.1 OVERVIEW - CU ADVANCED PACKAGING AND CHIP INTERCONNECTS METALLIZATION
- 4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS
4.3 ADVANCED PACKAGING METALLIZATION - MARKET DRIVERS
- 4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU PLATING REVENUE
- 4.3.2 ADVANCED PACKAGING - COPPER CHEMICALS REVENUE
- 4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES
- 4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
- 4.3.5 SN / SNAG PLATING
4.4 CHIP INTERCONNECTS GROWTH TRENDS
- 4.4.1 CHIP INTERCONNECTS GROWTH DRIVERS
- 4.4.2 CHIP INTERCONNECTS CU PLATING REVENUES
- 4.4.3 CHIP INTERCONNECTS ADDITIVE VOLUMES
4.5 MINE LOCATIONS FOR METALS IN PLATING CHEMICALS
4.6 POSSIBLE CHOKE POINTS FOR METALS USED IN IC PLATING
4.7 FUTURE POSSIBLE DEMAND PRICE PRESSURES

5 TECHNICAL TRENDS

5.1 CHEMISTRIES USE FOR SEMICONDUCTOR METAL PLATING
5.2 PACKAGING TECH TRENDS
- 5.2.1 PACKAGING TECHNICAL CHALLENGES
5.3 TECH TRENDS
- 5.3.1 MARKET DRIVES TECHNOLOGY TRENDS
- 5.3.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
- 5.3.3 CU INTERCONNECTS QUALIFICATION REQUIREMENTS
- 5.3.4 LOGIC METALLIZATION ROADMAP
- 5.3.5 ADV LOGIC BURIED POWER RAIL
- 5.3.6 TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
- 5.3.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
- 5.3.8 EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD
- 5.3.9 TECHNICAL REQUIREMENTS SUMMARY 1/2

6 COMPETITIVE LANDSCAPE

6.1 TOTAL ADVANCED PACKAGING AND INTERCONNECTS MARKET SHARES
6.2 OEM MARKET SHARE - PLATING EQUIPMENT
6.3 MARKET SHARE BY APPLICATION - CU PLATING FOR ADVANCED PACKAGING
6.4 REGIONAL PLAYERS AND OTHERS
6.5 M&A ACTIVITY

7 ANALYST ASSESSMENT

7.1 ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8 SUPPLIER PROFILES

BASF
DUPONT
CHANG CHUN GROUP
INCHEON CHEMICAL COMPANY
ISHIHARA CHEMICAL/UNICON
...AND 9 MORE

9 APPENDIX A: PACKAGING TECH TRENDS

9.1 TECHNOLOGY CHALLENGE
- 9.1.1 METAL CLEANINGS CHALLENGE
- 9.1.2 MARKET DYNAMIC
- 9.1.3 WAFER LEVEL PLATING-FIRST LEVEL INTERCONNECT
- 9.1.4 MARKET DRIVERS OF ADVANCED PACKAGING APPLICATIONS
- 9.1.5 WAFER LEVEL PACKAGING ARCHITECTURES
- 9.1.6 TECH TRENDS- RDL
- 9.1.7 MARKET DRIVERS OF CHIPLET ARCHITECTURE
- 9.1.8 TSV FILLING 2.5-3D
- 9.1.9 PACKAGING ELECTROPLATING REQUIREMENTS

簡介目錄圖表

LIST OF FIGURES

FIGURE 1.1: PLATING MATERIALS FOR ADVANCED PACKAGING AND INTERCONNECT REVENUES ($M'S)
FIGURE 1.2. WAFERS/YR & % OF PACKAGING THAT IS ADVANCED PACKAGING (AP)
FIGURE 1.3: ADV LOGIC DEVICE GROWTH FORECAST
FIGURE 1.4: COPPER PLATING CHEMICALS REVENUES ($M'S) FOR ADVANCED PACKAGING & FE CU INTERCONNECTS
FIGURE 1.5: 2023 SUPPLIER MARKET SHARES CU PLATING FOR INTERCONNECT ADDITIVES
FIGURE 1.6: 2023 SUPPLIER MARKET SHARES CU PLATING FOR ADV. PACKAGING
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES
FIGURE 3.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSII) IN 000'S OF NTD
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: PACKAGING METALLIZATION APPLICATIONS
FIGURE 4.2: USE OF SILICON INTERPOSER IN 2.5D PACKAGING
FIGURE 4.3: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
FIGURE 4.4: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE INTERCONNECT REVENUES (M'S)
FIGURE 4.5: CU PLATING CHEMICALS 5-YEAR FORECAST
FIGURE 4.6: WAFERS/YR & % OF PACKAGING THAT IS ADVANCED PACKAGING
FIGURE 4.7: REVENUE FORECAST CU PLATING ADVANCED PACKAGING
FIGURE 4.8: CU PILLAR & CU RDL SEGMENTED FORECAST
FIGURE 4.9: ADV. PACKAGING CU CUSO4 AMOUNT DEMAND FORECAST
FIGURE 4.10: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST ADV.PACKAGING CU PLATING ADDITIVES
FIGURE 4.11: BUMPING MATERIALS FOR FIRST LEVEL INTERCONNECT
FIGURE 4.12: HYBRID BONDING PROCESS
FIGURE 4.13: SN AND SNAG PLATING REVENUE
FIGURE 4.14: NICKEL PLATING REVENUE
FIGURE 4.15: ADV LOGIC DEVICE GROWTH FORECAST
FIGURE 4.16: METAL PLATING WAFER PASSES
FIGURE 4.17: WW DAMASCENE REVENUE FORECAST ESTIMATES
FIGURE 4.18: DAMASCENE CUSO4 VOLUME DEMAND FORECAST
FIGURE 4.19: DAMASCENE CU PLATING CHEMICAL AMOUNT DEMAND FORECAST
FIGURE 5.1: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 5.2: CHALLENGES OF ELECTROPLATING VIA FILL
FIGURE 5.3: METAL INTERCONNECTS BY LOGIC NODE
FIGURE 5.4: INTERCONNECT METAL COMPARISON BY RESISTIVITY
FIGURE 5.5: CU CHIP INTERCONNECTS QUALIFICATION
FIGURE 5.6: LEADING EDGE LOGIC POWER RAIL SCHEMES
FIGURE 5.7: DRAM STRUCTURE
FIGURE 5.8: 3D NAND STRUCTURE
FIGURE 6.1: TOTAL PLATING FOR ADV. PACKAGING AND CU INTERCONNECT ADDITIVES 2023
FIGURE 6.2: PLATING EQUIPMENT OEM MARKET SHARES % 2023
FIGURE 6.3: PLATING CHEMICAL SUPPLIER FOR INTERCONNECTS AND ADVANCED PACKAGING APPLICATIONS
FIGURE 9.1: CLEANING COMPLEXITY
FIGURE 9.2: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
FIGURE 9.3: WAFER LEVEL PLATING
FIGURE 9.4: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS
FIGURE 9.4: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS
FIGURE 9.5: FAN-IN (WLCSP) & FAN-OUT (WLFO) COMPARISON
FIGURE 9.6: RDL CIRCUITRY EXAMPLE
FIGURE 9.7: COMPARISON WITH DAMASCENE- TYPE RDL
FIGURE 9.8: COST/PERFORMANCE IMPROVEMENTS THROUGH CHIPLETS INTEGRATION
FIGURE 9.9: 2.5 AND 3D PACKAGING EXAMPLES
FIGURE 9.10: USE OF SILICON INTERPOSER
FIGURE 9.11: TSV PROCESS FLOW EXAMPLE
FIGURE 9.12: PROCESS COMPARISON OF TRADITIONAL VS. WLP FLOWS

LIST OF TABLES

TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023
TABLE 5.1: IRDS 2023 MORE MOORE INTERCONNECT ROADMAP
TABLE 5.2: BARRIER METAL ROADMAP
TABLE 5.3: METALS REQUIRED FOR DEVICE FEATURES
TABLE 5.4: DRAM USE OF MO OR RU PRESENT & FUTURE
TABLE 5.5: GENERAL PROCESS FLOW ADVANCED DRAM
TABLE 5.5: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
TABLE 5.6: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND - SOME ARE ESTIMATES FOR THE FUTURE
TABLE 5.7: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
TABLE 5.8: TECHNICAL REQUIREMENTS SUMMARY
TABLE 5.9: TECHNICAL REQUIREMENTS SUMMARY, CONTINUED
TABLE 6.1: REGIONAL PLAYERS - MARKET LEADER AND "OTHERS"
TABLE 9.1: CU PACKAGING APPLICATIONS AND REQUIREMENTS