3D半導體封裝市場、機會、成長動力、產業趨勢分析與預測，2024-2032

3D Semiconductor Packaging Market, Opportunity, Growth Drivers, Industry Trend Analysis and Forecast, 2024-2032

出版日期: 2024年08月29日 | 出版商:

Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

2023 年全球3D 半導體封裝市場價值為94 億美元，預計2024 年至2032 年複合年成長率將超過18%。。這項創新技術促進了多個積體電路 (IC) 層的堆疊，縮小了半導體裝置的佔地面積，同時提高了效能。這些進步對於消費性電子、汽車和電信等領域至關重要，在這些領域最佳化空間和效能至關重要。

整個 3D 半導體封裝產業根據技術、材料、最終用途和地區進行分類。

依材料細分，市場包括有機基板、鍵合線、引線框架、封裝樹脂、陶瓷封裝等。值得注意的是，有機基材領域在預測期內的複合年成長率將超過 16%。有機基板是 3D 半導體封裝領域的基礎，用於錨定和連接半導體元件。這些基板通常由環氧樹脂等經濟高效且適應性強的有機材料製成，能夠以 3D 格式巧妙地容納多個半導體晶片的複雜堆疊。

按最終用途分類時，市場涵蓋汽車、消費性電子、醫療保健、IT 和電信、工業、航空航太和國防等。值得注意的是，汽車產業有望佔據主導地位，預計到 2032 年收入將超過 120 億美元。高級駕駛輔助系統 (ADAS)、資訊娛樂系統、電動動力系統和自動駕駛等技術正在突破極限，需要即使在充滿挑戰的環境中也能表現出色的半導體。

2023年，北美在全球3D半導體封裝領域處於領先地位，佔據超過35%的市場。美國是塑造該地區市場格局的關鍵參與者。由於科技巨頭的大量投資和政府對半導體創新的支持，北美擁有強大的半導體設計和製造能力。該地區充滿活力的電子、電信和航空航太產業推動了對 3D 封裝的需求。此外，北美對人工智慧、機器學習和量子運算等開創性技術的承諾加大了對先進半導體封裝的需求。憑藉主要的半導體公司和對下一代技術的關注，北美鞏固了其在 3D 半導體封裝領域的地位。

產業生態系統分析
供應商矩陣
利潤率分析
技術與創新格局
專利分析
重要新聞和舉措
監管環境
衝擊力
- 成長動力
  - 對高性能和小型化設備的需求增加
  - 汽車產業越來越多的採用
  - 加大先進製造技術投入
  - 對資料中心和雲端運算的需求不斷成長
  - 電源效率和熱管理的重要性日益增加
- 產業陷阱與挑戰
  - 技術複雜性和產量問題
  - 供應鏈中斷和材料短缺
成長潛力分析
波特的分析
PESTEL分析

第 4 章：競爭格局

介紹
公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第 5 章：市場估計與預測：按技術分類，2021-2032 年

主要趨勢
3D 矽通孔
包裝上的 3D 包裝
3D 晶圓級晶片級封裝 (WL-CSP)
3D 系統單晶片 (3D SoC)
3D積體電路（3D IC）

第 6 章：市場估計與預測：按材料分類，2021-2032 年

主要趨勢
有機基材
鍵合線
引線框架
陶瓷封裝
封裝樹脂
其他

第 7 章：市場估計與預測：按最終用途產業，2021-2032 年

主要趨勢
消費性電子產品
汽車
衛生保健
資訊科技和電信
工業的
航太和國防
其他

第 8 章：市場估計與預測：按地區，2021-2032 年

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 歐洲其他地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳新銀行
- 亞太地區其他地區
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地區
MEA
- 阿拉伯聯合大公國
- 南非
- 沙烏地阿拉伯
- MEA 的其餘部分

第 9 章：公司簡介

Advanced Semiconductor Engineering, Inc.
Amkor Technology, Inc.
ASE Group
Fujitsu Limited
Intel Corporation
International Business Machines Corporation (IBM)
JCET Group Co., Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)
Micron Technology, Inc.
Nanya Technology Corporation
Powertech Technology Inc.
Qualcomm Technologies, Inc.
Samsung Electronics Co., Ltd.
Siliconware Precision Industries Co., Ltd. (SPIL)
SK Hynix Inc.
STMicroelectronics N.V.
SUSS MicroTec AG
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Texas Instruments Incorporated
Tongfu Microelectronics Co., Ltd.
United Microelectronics Corporation (UMC)
UTAC Holdings Ltd.

簡介目錄

Product Code: 11088

The Global 3D Semiconductor Packaging Market was valued at USD 9.4 billion in 2023 and is projected to grow at a CAGR exceeding 18% from 2024 to 2032. As global demand shifts towards more compact and powerful electronics, the appeal of 3D semiconductor packaging has intensified. This innovative technology facilitates the stacking of multiple Integrated Circuits (ICs) layers, shrinking the semiconductor devices' footprint while boosting performance. Such advancements are paramount in sectors like consumer electronics, automotive, and telecommunications, where optimizing space and performance is vital.

The overall 3D semiconductor packaging industry is classified based on technology, material, end-use, and region.

Segmented by material, the market encompasses organic substrates, bonding wires, lead frames, encapsulation resins, ceramic packages, and more. Notably, the organic substrates segment is set to witness a CAGR surpassing 16% during the forecast period. Organic substrates serve as the foundational bedrock in the 3D semiconductor packaging landscape, anchoring and linking semiconductor components. Typically crafted from cost-effective and adaptable organic materials like epoxy resins, these substrates adeptly accommodate the intricate stacking of multiple semiconductor dies in a 3D format.

When categorized by end-use, the market spans automotive, consumer electronics, healthcare, IT and telecommunications, industrial, aerospace and defense, and beyond. Notably, the automotive sector is poised to dominate, with projections suggesting revenues exceeding USD 12 billion by 2032. Modern vehicles are witnessing an intricate weave of electronic systems, propelling the demand for 3D semiconductor packaging in the automotive realm. Technologies like Advanced Driver-assistance Systems (ADAS), infotainment, electric powertrains, and autonomous driving are pushing the envelope, necessitating semiconductors that excel even in challenging environments.

In 2023, North America led the global 3D semiconductor packaging arena, clinching over 35% of the market share. The U.S. stands as a pivotal player, shaping the region's market landscape. Bolstered by substantial investments from tech giants and governmental backing for semiconductor innovation, North America boasts robust semiconductor design and manufacturing prowess. The region's vibrant electronics, telecommunications, and aerospace sectors fuel the demand for 3D packaging. Furthermore, North America's commitment to pioneering technologies like AI, ML, and quantum computing amplifies the call for advanced semiconductor packaging. With major semiconductor firms and a focus on next-gen technologies, North America solidifies its stature in the 3D semiconductor packaging domain.

Chapter 1 Methodology and Scope

1.1 Market scope and definition
1.2 Base estimates and calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360º synopsis, 2021-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology and innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Increased demand for high-performance and miniaturized devices
  - 3.8.1.2 Growing adoption in the automotive industry
  - 3.8.1.3 Increased investment in advanced manufacturing technologies
  - 3.8.1.4 Rising demand for data centers and cloud computing
  - 3.8.1.5 Growing importance of power efficiency and thermal management
- 3.8.2 Industry pitfalls and challenges
  - 3.8.2.1 Technical complexities and yield issues
  - 3.8.2.2 Supply chain disruptions and material shortages
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates and Forecast, By Technology, 2021-2032 (USD Million)

5.1 Key trends
5.2 3D Through silicon via
5.3 3D Package on package
5.4 3D Wafer-Level Chip-Scale Packaging (WL-CSP)
5.5 3D System-on-Chip (3D SoC)
5.6 3D Integrated Circuit (3D IC)

Chapter 6 Market Estimates and Forecast, By Material, 2021-2032 (USD Million)

6.1 Key trends
6.2 Organic substrates
6.3 Bonding wires
6.4 Lead frames
6.5 Ceramic packages
6.6 Encapsulation resins
6.7 Others

Chapter 7 Market Estimates and Forecast, By End-use Industry, 2021-2032 (USD Million)

7.1 Key trends
7.2 Consumer electronics
7.3 Automotive
7.4 Healthcare
7.5 IT and telecommunications
7.6 Industrial
7.7 Aerospace and defense
7.8 Others

Chapter 8 Market Estimates and Forecast, By Region, 2021-2032 (USD Million)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA