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1549780

高階半導體封裝：市場佔有率分析、產業趨勢與統計、成長預測（2024-2029）

High-end Semiconductor Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 100 Pages | 商品交期: 2-3個工作天內

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簡介目錄

高階半導體封裝市場規模預計2024年為369.5億美元，預計2029年將達到859.1億美元，在預測期內（2024-2029年）複合年成長率預計為15.10%。

高階半導體封裝市場

隨著封裝擴大用於提高電子系統的性能、可靠性和成本效益，行業中各個最終用戶垂直領域的需求不斷增加，整合、能源效率和產品性能的不斷發展正在加速市場成長。

主要亮點

  • 包裝可保護電子系統免受高頻噪音輻射、靜電放電、機械損壞和冷卻的影響。全球半導體產業的成長是推動半導體封裝市場成長的主要因素之一。此外，2023年2月，半導體產業協會（SIA）宣布，2022年全球半導體產業銷售額將達到5,741億美元，創歷史最高年度總合，比前一年公佈的5,559億美元成長3.3%。
  • 此外，物聯網和人工智慧的興起以及複雜電子設備的激增正在推動消費性電子和汽車行業的高階應用。這些因素正在推動更先進的半導體封裝技術來維持需求。該領域研究活動的活性化進一步刺激了市場需求。
  • 此外，由於 5G、物聯網、汽車和 HPC 等多個長期成長促進因素，半導體封裝市場預計將擴大。例如，印度政府已核准一項100億美元的獎勵計劃，以建立包括晶圓廠、本土晶片設計和化合物半導體晶圓廠在內的完整半導體生態系統。
  • 此外，COVID-19大流行對電子產業產生了重大影響，半導體供應鏈問題和晶片短缺已經影響該產業一段時間。然而，全球半導體產業投資的增加和半導體製造設施的增加預計將推動後疫情時代的市場成長。

高階半導體封裝市場趨勢

消費性電子產業可望提振市場

  • 消費性電子領域正大力投資半導體封裝市場。智慧型手機的成長、穿戴式裝置和智慧型裝置的滲透率不斷提高，以及消費者物聯網裝置在智慧家庭等應用中的滲透率不斷提高，是影響該細分市場成長的一些因素。愛立信預計，2022年全球智慧型手機行動網路用戶數量預計將達到約66億，2028年將超過78億人。
  • 此外，由於複雜的半導體元件可以提供越來越多的功能和特性，智慧型手錶和智慧揚聲器市場近年來變得非常受歡迎。因此，對Wi-Fi和藍牙晶片的需求急劇增加。消費性電子製造商也利用半導體元件為其產品配備物聯網和人工智慧模型，以改善用戶體驗並為產品增添光彩。
  • 例如，2023年3月，華為計畫在未來幾年推出一款電池大幅升級的折疊式智慧型手機。該設備具有電池升級功能。此外，華為預計將採用高矽負極材料來增強智慧型手機的電池容量，預計電池容量將達到5,060mAh。
  • 電腦和筆記型電腦現已成為大力投資科技的年輕消費者的必需品。此外，電子領域的技術創新和進步預計將在未來 10 年推動半導體封裝銷售。物聯網和人工智慧的引入預計將增加全球新興市場和已開發市場的半導體封裝銷售。
  • 英特爾公司和倫敦大學學院 (UCL) 聯合推出了一款新型非接觸式電腦，可以使用手部和臉部手勢進行操作和控制。電子市場不斷要求更高的功耗、更高的速度、更多的引腳數、更小的佔地面積和更薄的設計。半導體的小型化和整合化正在創造更輕、更小、更便攜的家用電器，例如智慧型手機、平板電腦和新興的物聯網設備。

北美市場正在經歷顯著成長

  • 美國和加拿大的半導體產業在人工智慧、量子運算和 5G 等先進無線網路等未來關鍵技術中保持著重要地位。
  • 例如，根據GSMA的預測，2025年5G將成為美國領先的網路技術。 5G 網路部署的不斷增加，恰逢對更即時、高效能運算設備的需求不斷成長，其中半導體是關鍵要素。
  • 美國政府正在大力投資以促進先進技術的採用，從而增強對先進半導體封裝的需求。美國參議院宣布了促進美國製造半導體（FABS）法案。該法案可為半導體製造設備和工廠的投資提供 25% 的投資稅額扣抵。
  • 此外，美國是最大的電動車市場之一，近年來電動車銷量快速成長。汽車創新聯盟的數據顯示，2023年第四季國內電動車銷量超過37.7萬輛，較2022年第四季成長34%。
  • 近年來，日本實施了多項法規來推廣電動車的使用。例如，紐約州立法機關通過了一項法案，實際上要求到 2035 年該州銷售的所有新乘用車都必須採用電力驅動。此外，美國也制定了2030年該國銷售的汽車一半為電動車的目標。

高階半導體封裝產業概況

高階半導體封裝市場正在整合。公司正在利用產品創新、擴張和合作夥伴關係來在競爭中生存並擴大市場範圍。

  • 2024 年 5 月 著名的半導體封裝測試公司 Siliconware Precision Industries (SPIL) 最近在檳城決明城科技園區開設了馬來西亞 P1 工廠。未來15年，SPIL計劃部署包括晶圓凸塊在內的新技術，並提供全面的承包解決方案，包括晶圓凸塊、晶圓級晶片封裝、覆晶構裝和測試。
  • 2024 年 3 月，韓國 Nepes Corporation 將與西門子 EDA 合作，解決先進 3D-IC 封裝中複雜的熱學、機械和IC封裝設計挑戰。 Nepes 專注於晶圓級、扇出晶圓級和麵板級封裝設計。 Nepes 利用其專業知識，利用西門子 EDA 技術（包括 Calibre nmPlatform、HyperLynx 和 Xpedition 軟體）來推動包裝創新。透過整合這些西門子解決方案，Nepes將能夠增強其設計能力，並為全球IC客戶提供快速可靠的2.5D/3D小晶片設計服務。

其他好處

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場洞察

  • 市場概況
  • 產業吸引力－波特五力分析
    • 供應商的議價能力
    • 買方議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭公司之間敵對關係的強度
  • 產業價值鏈分析
  • 評估宏觀經濟趨勢對市場的影響

第5章市場動態

  • 市場促進因素
    • 各行業半導體元件消費擴大
    • 擴大 3D 列印在半導體封裝的應用
  • 市場限制因素
    • 半導體IC設計初始投資高且複雜

第6章 市場細分

  • 依技術
    • 3D SoC
    • 3D堆疊內存
    • 2.5D中介層
    • UHD FO（超高密度扇出）
    • 內置矽橋
  • 按最終用戶
    • 家用電子產品
    • 航太/國防
    • 醫療設備
    • 電訊
    • 車
    • 其他最終用戶
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 英國
      • 德國
      • 法國
      • 義大利
    • 亞洲
      • 中國
      • 印度
      • 日本
      • 澳洲/紐西蘭
      • 東南亞
    • 拉丁美洲
    • 中東/非洲

第7章 競爭格局

  • 公司簡介
    • Intel Corporation
    • Taiwan Semiconductor Manufacturing Company
    • Advanced Semiconductor Engineering Inc.
    • Samsung Electronics Co. Ltd
    • Amkor Technology Inc.
    • JCET Group Co. Ltd
    • TongFu Microelectronics Co. Ltd
    • Fujitsu Limited
    • Siliconware Precision Industries Co. Ltd
    • Powertech Technology Inc.

第8章投資分析

第9章市場的未來

簡介目錄
Product Code: 91352

The High-end Semiconductor Packaging Market size is estimated at USD 36.95 billion in 2024, and is expected to reach USD 85.91 billion by 2029, growing at a CAGR of 15.10% during the forecast period (2024-2029).

High-end Semiconductor Packaging - Market

The continuous advancements in integration, energy efficiency, and product characteristics because of the growing demand across various end-user verticals of the industry and the use of packaging for improving the performance, reliability, and cost-effectiveness of electronic systems accelerate the market's growth.

Key Highlights

  • Packaging protects an electronic system from radio frequency noise emission, electrostatic discharge, mechanical damage, and cooling. The rise in the semiconductor industry worldwide is one of the major factors driving the growth of the semiconductor packaging market. In addition, in February 2023, the Semiconductor Industry Association (SIA) announced global semiconductor industry sales totaled USD 574.1 billion in 2022, the highest-ever annual total and an increase of 3.3% compared to the previous year's total of USD 555.9 billion.
  • Furthermore, the rise of IoT and AI and the proliferation of complex electronics drive the high-end application segment in the consumer electronics and automotive industries. Due to these factors, more advanced semiconductor packaging technologies are being adopted to sustain demand. The growing research activities in the sector further bolstered the market's demand.
  • Furthermore, the semiconductor packaging market is expected to expand due to multiple long-term growth drivers, like 5G, IoT, automotive, and HPC. For instance, the Government of India approved a USD 10 billion incentive package to build a complete semiconductor ecosystem, including fabs, home-grown chip design, and compound semiconductor plants.
  • Moreover, the COVID-19 pandemic significantly impacted the electronics industry, with semiconductor supply chain issues and the chip shortage affecting the industry for some time. However, the growing investments in the semiconductor industry and increased establishments of semiconductor manufacturing facilities worldwide are anticipated to propel the market's growth in the post-pandemic era.

High-end Semiconductor Packaging Market Trends

Consumer Electronics Sector is Expected to Boost the Market

  • The consumer electronics sector is significantly investing in the semiconductor packaging market. Growth of the smartphone, rising wearable and smart device adoption, and increasing consumer IoT device penetration in applications like smart homes are a few of the influential factors influencing the segment's growth. According to Ericsson, smartphone mobile network subscriptions worldwide reached nearly 6.6 billion in 2022, and they are predicted to exceed 7.8 billion by 2028.
  • Additionally, markets for smartwatches and smart speakers have become extremely popular in recent years due to the growing number of features and functionalities they can offer due to sophisticated semiconductor components. As a result, the demand for Wi-Fi and Bluetooth chips increased dramatically. Consumer electronics manufacturers also use semiconductor components to equip their products with IoT and AI models, enhancing user experience and making products brighter.
  • For instance, in March 2023, Huawei planned to launch its foldable smartphone with a significant battery upgrade in the coming years. The device will feature an upgrade to its battery. Further, Huawei is expected to use a high-silicon anode material to enhance the smartphone's battery capacity, which is expected to be 5,060 mAh.
  • Personal computers and laptops are now essential for young consumers who are heavily invested in technology. In addition, over the next ten years, innovation and advancement in the electronics sector are anticipated to drive semiconductor packaging sales. Sales of semiconductor packaging are expected to increase globally in both developing and developed markets due to the introduction of IoT and AI.
  • Intel Corporation and the University College London (UCL) have collaborated to introduce a new touchless computer that can be operated and controlled by gesturing the hands and face. Higher power dissipation, faster speeds, higher pin counts, smaller footprints, and lower profiles are all constant demands in the electronics market. Semiconductor miniaturization and integration have resulted in lighter, smaller, and more portable appliances such as smartphones, tablets, and emerging IoT devices.

North America to Experience Significant Market Growth

  • The semiconductor sector in the United States and Canada has maintained a significant position in key future technologies, such as AI, quantum computing, and sophisticated wireless networks like 5G.
  • For instance, as per GSMA, 5G will become the lead network technology in the United States by 2025. The increasing implementation of 5G networks coincides with the growing demand for more immediate high-performance computing appliances, for which semiconductors form a critical element.
  • The US government has significantly invested in boosting the penetration of advanced technologies, bolstering the demand for high-end semiconductor packaging. The US Senate announced the Facilitating American-Built Semiconductors (FABS) Act, which may provide tax incentives to semiconductor manufacturers. The bill may establish a 25% investment tax credit for semiconductor manufacturing investments in equipment or fabs.
  • Furthermore, the United States is one of the largest markets for electric vehicles, and the country has also recorded rapid growth in EV sales in recent years. More than 377,000 EVs were sold in the country in Q4 2023, registering a 34% increase from Q4 2022, according to Alliance for Automotive Innovation.
  • Many regulations have been implemented in recent years to promote the use of electric vehicles in the country. For instance, New York state lawmakers passed a bill that essentially mandates that all new passenger cars sold in the state run on electric power by 2035. Moreover, the United States has set a target to ensure half of the vehicles sold in the country are electric by 2030.

High-end Semiconductor Packaging Industry Overview

The high-end semiconductor packaging market is consolidated. Companies employ product innovation, expansions, and partnerships to stay ahead of the competition and widen their market reach.

  • May 2024: Siliconware Precision Industries Co. Ltd (SPIL), a prominent player in semiconductor packaging and testing, recently marked the commencement of its Malaysia P1 plant at Bandar Cassia Technology Park, Pulau Pinang. Over the next 15 years, SPIL plans to roll out new technologies, including wafer bumping, and provide a holistic turnkey solution encompassing wafer bumping, wafer-level chip packaging, flip chip packaging, and testing.
  • March 2024: Nepes Corporation in South Korea partnered with Siemens EDA to address complex thermal, mechanical, and IC packaging design challenges in advanced 3D-IC packages. Nepes specializes in wafer-level, fan-out wafer-level, and panel-level packaging designs. Expanding on its expertise, Nepes is driving packaging innovations using Siemens EDA's technologies, including the Calibre nmPlatform, HyperLynx, and Xpedition software. By integrating these Siemens solutions, Nepes has enhanced its design capabilities, enabling swift and dependable services in 2.5D/3D chiplet designs for its global IC clientele.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definitions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Assessment of the Impact of Macroeconomic Trends on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Consumption of Semiconductor Devices Across Industries
    • 5.1.2 Growing Adoption of 3D Printing in Semiconductor Packaging
  • 5.2 Market Restraints
    • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6 MARKET SEGMENTATION

  • 6.1 By Technology
    • 6.1.1 3D SoC
    • 6.1.2 3D Stacked Memory
    • 6.1.3 2.5D interposers
    • 6.1.4 UHD FO
    • 6.1.5 Embedded Si Bridge
  • 6.2 By End User
    • 6.2.1 Consumer Electronics
    • 6.2.2 Aerospace and Defense
    • 6.2.3 Medical Devices
    • 6.2.4 Telecom and Communication
    • 6.2.5 Automotive
    • 6.2.6 Other End Users
  • 6.3 By Geography
    • 6.3.1 North America
      • 6.3.1.1 United States
      • 6.3.1.2 Canada
    • 6.3.2 Europe
      • 6.3.2.1 United Kingdom
      • 6.3.2.2 Germany
      • 6.3.2.3 France
      • 6.3.2.4 Italy
    • 6.3.3 Asia
      • 6.3.3.1 China
      • 6.3.3.2 India
      • 6.3.3.3 Japan
      • 6.3.3.4 Australia and New Zealand
      • 6.3.3.5 South East Asia
    • 6.3.4 Latin America
    • 6.3.5 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Intel Corporation
    • 7.1.2 Taiwan Semiconductor Manufacturing Company
    • 7.1.3 Advanced Semiconductor Engineering Inc.
    • 7.1.4 Samsung Electronics Co. Ltd
    • 7.1.5 Amkor Technology Inc.
    • 7.1.6 JCET Group Co. Ltd
    • 7.1.7 TongFu Microelectronics Co. Ltd
    • 7.1.8 Fujitsu Limited
    • 7.1.9 Siliconware Precision Industries Co. Ltd
    • 7.1.10 Powertech Technology Inc.

8 INVESTMENTS ANALYSIS

9 FUTURE OF THE MARKET