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市場調查報告書
商品編碼
1556178

2024 年先進晶片封裝全球市場報告

Advanced Chip Packaging Global Market Report 2024
出版日期: | 出版商: The Business Research Company | 英文 175 Pages | 商品交期: 2-10個工作天內

價格
簡介目錄

先進晶片封裝的市場規模預計在未來幾年將快速成長。 2028年，將以18.3%的複合年成長率成長至242.9億美元。預測期內的預期成長受到幾個關鍵因素的推動，包括 5G 技術的普及、物聯網 (IoT) 設備的擴展、人工智慧 (AI) 和機器學習的日益普及以及穿戴式技術的興起。 。預測期內的顯著趨勢包括3D封裝技術的使用增加、溫度控管的進步、高密度互連技術的進步、扇出晶圓級封裝技術的擴展以及軟性和可拉伸封裝，其中包括管理的發展。

家用電子電器產品需求的成長預計將推動先進晶片封裝市場的成長。家用電子電器包括智慧型手機、平板電腦、筆記型電腦等。網際網路和無線網路的擴展顯著增加了對這些設備的需求。先進的晶片封裝技術有助於將高效能家用電子電器必需的多種功能整合到緊湊的設計中。這些技術提高了處理能力、效率和散熱，從而能夠創建功能豐富且緊湊的設備。例如，根據日本電子情報技術產業協會2023年5月發布的報告，消費性電子產品產值達2.095億美元，與前一年同期比較增加127%。因此，家用電子電器的需求不斷成長，推動了先進晶片封裝市場的擴張。

先進晶片封裝市場的主要參與者正在專注於開發晶片級封裝（CSP）技術，以提高半導體裝置的性能、小型化和可靠性。 CSP技術涉及封裝，其封裝尺寸與半導體晶片本身大致相同。 2022年9月，美國LED創新公司Bridgelux Inc.推出了晶片級封裝（CSP）LED，提供1800K至6500K、CRI值70至95、RGB顏色至全光譜。這款 LED 採用帶有磷光體塗層的覆晶技術，無需鍵合線或塑膠模具，從而改善了溫度控管並增加了光通量產量。 CSP2727 車型擁有業界領先的效率，在 350 mA 時為 209 lm/W，在 700 mA 時為 190 lm/W，非常適合商業照明應用。 CSP LED 有助於順利、靈活地進行基板組裝，從而為商業、娛樂、工業和戶外等各種照明應用創建客戶特定的 COB（板上晶片）模組。

目錄

第1章執行摘要

第2章 市場特點

第3章 市場趨勢與策略

第4章宏觀經濟情景

  • 高通膨對市場的影響
  • 烏克蘭與俄羅斯戰爭對市場的影響
  • COVID-19 對市場的影響

第5章世界市場規模與成長

  • 全球先進晶片封裝市場：促進因素與限制因素
    • 市場促進因素
    • 市場限制因素
  • 全球先進晶片封裝市場表現：規模與成長，2018-2023
  • 全球先進晶片封裝市場預測：規模與成長，2023-2028，2033F

第6章 市場細分

  • 全球先進晶片封裝市場：依封裝分類的表現與預測，2018-2023、2023-2028F、2033F
  • 球柵陣列 (BGA)
  • 四方扁平封裝 (QFP)
  • 晶片級封裝 (CSP)
  • 晶圓級晶片尺寸封裝 (WLCSP)
  • 全球先進晶片封裝市場：依技術分類的表現與預測，2018-2023、2023-2028F、2033F
  • 五維 (5D) 包裝
  • 3D(3D) 包裝
  • 扇出晶圓級封裝
  • 覆晶構裝
  • 系統級封裝解決方案
  • 全球先進晶片封裝市場：最終用途產業的表現與預測，2018-2023、2023-2028F、2033F
  • 電子產品
  • 車
  • 通訊
  • 產業
  • 衛生保健
  • 航太和國防

第 7 章 區域/國家分析

  • 全球先進晶片封裝市場：按地區分類的表現與預測，2018-2023、2023-2028F、2033F
  • 全球先進晶片封裝市場：依國家分類的表現與預測，2018-2023、2023-2028F、2033F

第8章亞太市場

第9章 中國市場

第10章 印度市場

第11章 日本市場

第12章 澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第17章 德國市場

第18章 法國市場

第19章 義大利市場

第20章 西班牙市場

第21章 東歐市場

第22章 俄羅斯市場

第23章 北美市場

第24章美國市場

第25章加拿大市場

第26章 南美洲市場

第27章 巴西市場

第28章 中東市場

第29章 非洲市場

第30章 競爭格局及公司概況

  • 先進晶片封裝市場：競爭格局
  • 先進晶片封裝市場：公司簡介
    • Samsung Electronics Co. Ltd.
    • Advanced Micro Devices Inc.
    • Advanced Semiconductor Engineering Inc
    • Henkel Group
    • Texas Instruments Incorporated

第31章 其他大型創新企業

  • Lam Research Corporation
  • NXP Semiconductors
  • Onsemi
  • Amkor Technology
  • Nordson Corporation
  • Siliconware Precision Industries Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • ChipMOS Technologies Inc.
  • SUSS MicroTec SE
  • EV Group
  • Indium Corporation
  • Palomar Technologies
  • Brewer Science Inc.
  • MacDermid Alpha Electronics Solutions
  • Universal Instruments Corporation

第32章競爭基準化分析

第 33 章. 競爭對手儀表板

第34章 重大併購

第35章前瞻性與潛力分析

第36章附錄

簡介目錄
Product Code: r19526

Advanced chip packaging refers to advanced processes and technologies used to encase and connect semiconductor devices (chips) to their external environments, commonly found within electronic devices. This method offers design flexibility, allowing for the creation of tailored solutions for specific applications and performance requirements.

The main types of advanced chip packaging include ball grid array (BGA), quad flat package (QFP), chip scale package (CSP), and wafer-level chip scale package (WLCSP). A ball grid array is an integrated circuit packaging type that employs an array of solder balls on the bottom of the package to provide electrical connections to the printed circuit board. This design facilitates higher pin counts, enhanced thermal performance, and more compact designs compared to traditional pin-based packages. Technologies such as five-dimensional (5D) packaging, three-dimensional (3D) packaging, fan-out wafer-level packaging, flip-chip packaging, and system-in-package solutions are utilized in various industries, including electronics, automotive, telecommunications, industrial, healthcare, aerospace, and defense.

The advanced chip packaging market research report is one of a series of new reports from The Business Research Company that provides advanced chip packaging market statistics, including the advanced chip packaging industry global market size, regional shares, competitors with the advanced chip packaging market share, detailed advanced chip packaging market segments, market trends, and opportunities, and any further data you may need to thrive in the advanced chip packaging industry. These advanced chip packaging market research reports deliver a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The advanced chip packaging market size has grown rapidly in recent years. It will grow from $10.51 billion in 2023 to $12.41 billion in 2024 at a compound annual growth rate (CAGR) of 18.1%. The growth observed during the historic period can be attributed to several factors such as the increasing demand for smaller, more powerful consumer electronics, the proliferation of mobile devices and smartphones, the expansion of high-speed data networks, the rising integration of electronics in the automotive sector, and the evolving requirements of computing technology.

The advanced chip packaging market size is expected to see rapid growth in the next few years. It will grow to $24.29 billion in 2028 at a compound annual growth rate (CAGR) of 18.3%. The anticipated growth during the forecast period is driven by several key factors such as the widespread adoption of 5G technology, the expansion of Internet of Things (IoT) devices, the increasing prevalence of artificial intelligence (AI) and machine learning, and the rise of wearable technology. Notable trends for the forecast period include the growing use of 3D packaging technologies, advancements in thermal management, progress in high-density interconnect technologies, expansion of fan-out wafer-level packaging technologies, and the development of flexible and stretchable packaging solutions.

The rising demand for consumer electronic devices is anticipated to drive the growth of the advanced chip packaging market. Consumer electronic devices, which are designed for everyday use in private homes, include smartphones, tablets, and laptops. The expansion of internet and wireless networks has significantly increased the demand for these devices. Advanced chip packaging technologies facilitate the integration of multiple functions into compact designs, which are essential for high-performance consumer electronics. These technologies improve processing power, efficiency, and heat dissipation, enabling the creation of feature-rich, compact devices. For instance, a report published by the Japan Electronics and Information Technology Industries Association in May 2023 indicated that consumer electronics production reached $209.50 million, representing a 127% increase compared to the previous year. Consequently, the growing demand for consumer electronic devices is fueling the expansion of the advanced chip packaging market.

Major players in the advanced chip packaging market are focusing on the development of chip-scale package (CSP) technology to enhance semiconductor device performance, miniaturization, and reliability. CSP technology involves packaging where the package dimensions are nearly the same as the semiconductor chip itself. In September 2022, Bridgelux Inc., a US-based LED innovation company, introduced its Chip Scale Package (CSP) LEDs, which range from 1800K to 6500K, with CRI values from 70 to 95, and offer RGB color to full spectrum. Utilizing flip-chip technology with a phosphor coating, these LEDs eliminate the need for bond wires and plastic molds, resulting in improved heat management and increased luminous flux production. The CSP2727 model boasts an industry-leading efficacy of 209 lm/W at 350 mA and 190 lm/W at 700 mA, making it well-suited for commercial lighting applications. The CSP LEDs facilitate smooth and flexible board assembly, allowing for the creation of customer-specific Chip-on-Board (COB) modules for various lighting applications including commercial, entertainment, industrial, and outdoor settings.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed amount. This acquisition expands Lam Research's capabilities in innovative packaging solutions, particularly for advanced logic chips and chipset-based systems. The acquisition includes a state-of-the-art research and development facility located in Austria, which enhances Lam Research's expertise in next-generation substrates and heterogeneous packaging. SEMSYSCO GmbH, an Austria-based provider of wet-processing semiconductor equipment, will contribute to Lam Research's advanced chip packaging efforts.

Major companies operating in the advanced chip packaging market are Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation

Asia-Pacific was the largest region in the advanced chip packaging market in 2023. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced chip packaging market consists of revenues earned by entities by providing services such as multi-chip modules, through-silicon vias, lead frame packages, and embedded die packaging. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced chip packaging market also includes sales of wire bonders, encapsulation equipment, die-attach equipment, and test and inspection equipment. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Chip Packaging Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced chip packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
  • Understand how the market has been affected by the COVID-19 and how it is responding as the impact of the virus abates.
  • Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for advanced chip packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced chip packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of COVID-19 on supply chains and consumption patterns.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Packaging: Ball Grid Array (BGA); Quad Flat Package (QFP); Chip Scale Package (CSP); Wafer-Level Chip Scale Package (WLCSP)
  • 2) By Technology: Five-Dimensional (5D) Packaging; Three-Dimensional (3D) Packaging; Fan-Out Wafer-Level Packaging; Flip-Chip Packaging; System-In-Package Solutions
  • 3) By End-Use Industry: Electronics; Automotive; Telecommunications; Industrial; Healthcare; Aerospace And Defense
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Advanced Micro Devices Inc.; Advanced Semiconductor Engineering Inc; Henkel Group; Texas Instruments Incorporated
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Chip Packaging Market Characteristics

3. Advanced Chip Packaging Market Trends And Strategies

4. Advanced Chip Packaging Market - Macro Economic Scenario

  • 4.1. Impact Of High Inflation On The Market
  • 4.2. Ukraine-Russia War Impact On The Market
  • 4.3. COVID-19 Impact On The Market

5. Global Advanced Chip Packaging Market Size and Growth

  • 5.1. Global Advanced Chip Packaging Market Drivers and Restraints
    • 5.1.1. Drivers Of The Market
    • 5.1.2. Restraints Of The Market
  • 5.2. Global Advanced Chip Packaging Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
  • 5.3. Global Advanced Chip Packaging Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. Advanced Chip Packaging Market Segmentation

  • 6.1. Global Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Ball Grid Array (BGA)
  • Quad Flat Package (QFP)
  • Chip Scale Package (CSP)
  • Wafer-Level Chip Scale Package (WLCSP)
  • 6.2. Global Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Five-Dimensional (5D) Packaging
  • Three-Dimensional (3D) Packaging
  • Fan-Out Wafer-Level Packaging
  • Flip-Chip Packaging
  • System-In-Package Solutions
  • 6.3. Global Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Electronics
  • Automotive
  • Telecommunications
  • Industrial
  • Healthcare
  • Aerospace And Defense

7. Advanced Chip Packaging Market Regional And Country Analysis

  • 7.1. Global Advanced Chip Packaging Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 7.2. Global Advanced Chip Packaging Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific Advanced Chip Packaging Market

  • 8.1. Asia-Pacific Advanced Chip Packaging Market Overview
  • Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.3. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.4. Asia-Pacific Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China Advanced Chip Packaging Market

  • 9.1. China Advanced Chip Packaging Market Overview
  • 9.2. China Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.3. China Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.4. China Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India Advanced Chip Packaging Market

  • 10.1. India Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.2. India Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.3. India Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan Advanced Chip Packaging Market

  • 11.1. Japan Advanced Chip Packaging Market Overview
  • 11.2. Japan Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.3. Japan Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.4. Japan Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia Advanced Chip Packaging Market

  • 12.1. Australia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.2. Australia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.3. Australia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia Advanced Chip Packaging Market

  • 13.1. Indonesia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.2. Indonesia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.3. Indonesia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea Advanced Chip Packaging Market

  • 14.1. South Korea Advanced Chip Packaging Market Overview
  • 14.2. South Korea Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.3. South Korea Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.4. South Korea Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe Advanced Chip Packaging Market

  • 15.1. Western Europe Advanced Chip Packaging Market Overview
  • 15.2. Western Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.3. Western Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.4. Western Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK Advanced Chip Packaging Market

  • 16.1. UK Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.2. UK Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.3. UK Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany Advanced Chip Packaging Market

  • 17.1. Germany Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.2. Germany Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.3. Germany Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France Advanced Chip Packaging Market

  • 18.1. France Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.2. France Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.3. France Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy Advanced Chip Packaging Market

  • 19.1. Italy Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.2. Italy Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.3. Italy Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain Advanced Chip Packaging Market

  • 20.1. Spain Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.2. Spain Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.3. Spain Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe Advanced Chip Packaging Market

  • 21.1. Eastern Europe Advanced Chip Packaging Market Overview
  • 21.2. Eastern Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.3. Eastern Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.4. Eastern Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia Advanced Chip Packaging Market

  • 22.1. Russia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.2. Russia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.3. Russia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America Advanced Chip Packaging Market

  • 23.1. North America Advanced Chip Packaging Market Overview
  • 23.2. North America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.3. North America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.4. North America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA Advanced Chip Packaging Market

  • 24.1. USA Advanced Chip Packaging Market Overview
  • 24.2. USA Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.3. USA Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.4. USA Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada Advanced Chip Packaging Market

  • 25.1. Canada Advanced Chip Packaging Market Overview
  • 25.2. Canada Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.3. Canada Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.4. Canada Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America Advanced Chip Packaging Market

  • 26.1. South America Advanced Chip Packaging Market Overview
  • 26.2. South America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.3. South America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.4. South America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil Advanced Chip Packaging Market

  • 27.1. Brazil Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.2. Brazil Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.3. Brazil Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East Advanced Chip Packaging Market

  • 28.1. Middle East Advanced Chip Packaging Market Overview
  • 28.2. Middle East Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.3. Middle East Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.4. Middle East Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa Advanced Chip Packaging Market

  • 29.1. Africa Advanced Chip Packaging Market Overview
  • 29.2. Africa Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.3. Africa Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.4. Africa Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. Advanced Chip Packaging Market Competitive Landscape And Company Profiles

  • 30.1. Advanced Chip Packaging Market Competitive Landscape
  • 30.2. Advanced Chip Packaging Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd.
      • 30.2.1.1. Overview
      • 30.2.1.2. Products and Services
      • 30.2.1.3. Strategy
      • 30.2.1.4. Financial Performance
    • 30.2.2. Advanced Micro Devices Inc.
      • 30.2.2.1. Overview
      • 30.2.2.2. Products and Services
      • 30.2.2.3. Strategy
      • 30.2.2.4. Financial Performance
    • 30.2.3. Advanced Semiconductor Engineering Inc
      • 30.2.3.1. Overview
      • 30.2.3.2. Products and Services
      • 30.2.3.3. Strategy
      • 30.2.3.4. Financial Performance
    • 30.2.4. Henkel Group
      • 30.2.4.1. Overview
      • 30.2.4.2. Products and Services
      • 30.2.4.3. Strategy
      • 30.2.4.4. Financial Performance
    • 30.2.5. Texas Instruments Incorporated
      • 30.2.5.1. Overview
      • 30.2.5.2. Products and Services
      • 30.2.5.3. Strategy
      • 30.2.5.4. Financial Performance

31. Advanced Chip Packaging Market Other Major And Innovative Companies

  • 31.1. Lam Research Corporation
  • 31.2. NXP Semiconductors
  • 31.3. Onsemi
  • 31.4. Amkor Technology
  • 31.5. Nordson Corporation
  • 31.6. Siliconware Precision Industries Co. Ltd.
  • 31.7. Kulicke and Soffa Industries Inc.
  • 31.8. ChipMOS Technologies Inc.
  • 31.9. SUSS MicroTec SE
  • 31.10. EV Group
  • 31.11. Indium Corporation
  • 31.12. Palomar Technologies
  • 31.13. Brewer Science Inc.
  • 31.14. MacDermid Alpha Electronics Solutions
  • 31.15. Universal Instruments Corporation

32. Global Advanced Chip Packaging Market Competitive Benchmarking

33. Global Advanced Chip Packaging Market Competitive Dashboard

34. Key Mergers And Acquisitions In The Advanced Chip Packaging Market

35. Advanced Chip Packaging Market Future Outlook and Potential Analysis

  • 35.1 Advanced Chip Packaging Market In 2028 - Countries Offering Most New Opportunities
  • 35.2 Advanced Chip Packaging Market In 2028 - Segments Offering Most New Opportunities
  • 35.3 Advanced Chip Packaging Market In 2028 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer