Product Code: GVR-4-68040-338-4
Semiconductor Packaging Market Trends
The global semiconductor packaging market size was estimated at USD 40.91 billion in 2023 and is expected to grow at a CAGR of 10.2% from 2024 to 2030. With the proliferation of smartphones, tablets, and other consumer electronics, the need for advanced semiconductor packaging is rising. These devices require compact and efficient packaging solutions that ensure high performance and reliability.
The automotive industry's shift towards electric vehicles (EVs) and autonomous driving technologies necessitates sophisticated semiconductor packaging to handle higher performance and reliability standards. Companies like TSMC and Intel are investing heavily in automotive-grade semiconductor solutions. The growing adoption of Artificial Intelligence (AI) and the Internet of Things (IoT) is fueling the demand for advanced packaging technologies. These technologies require high integration levels and efficient heat dissipation, driving innovations in packaging solutions like Fan-Out Wafer Level Packaging (FO-WLP) and System-in-Package (SiP).
The trend towards miniaturization in electronics is driving the need for smaller, more efficient packaging solutions. This demand is boosting the adoption of 3D packaging technologies that allow more functionalities to be packed into smaller spaces. The development of new materials such as organic substrates and advanced encapsulation resins is creating opportunities for more efficient and durable packaging solutions. For instance, in 2023, Amkor Technology launched new advanced substrate materials that enhance thermal performance and reliability.
Global Semiconductor Packaging Market Report Segmentation
This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2018 to 2030. For this study, Grand View Research has segmented the global semiconductor packaging market report based on material, technology, end-use, and region:
- Material Outlook (Revenue, USD Million, 2018 - 2030)
- Organic Substrate
- Bonding Wire
- Leadframes
- Encapsulation Resins
- Ceramic Package
- Die Attach Material
- Thermal Interface Materials
- Solder Balls
- Others
- Technology Outlook (Revenue, USD Million, 2018 - 2030)
- Advanced Packaging
Flip Chip
SIP
5D/3D
Embedded Die
Fan-in Wafer Level Packaging (FI-WLP)
Fan-out Wafer Level Packaging (FO-WLP)
- Traditional Packaging
- End-use Outlook (Revenue, USD Million, 2018 - 2030)
- Consumer Electronics
- Automotive
- Healthcare
- IT & Telecommunication
- Aerospace & Defence
- Others
- Regional Outlook (Revenue, USD Million, 2018 - 2030)
- North America
U.S.
Canada
Mexico
Germany
UK
France
Italy
Spain
China
India
Japan
South Korea
Brazil
Argentina
Israel
UAE
South Africa
Table of Contents
Chapter 1. Methodology and Scope
- 1.1. Market Segmentation & Scope
- 1.2. Market Definition
- 1.3. Information Procurement
- 1.3.1. Purchased Database
- 1.3.2. GVR's Internal Database
- 1.3.3. Secondary Materials & Third-Party Perspectives
- 1.3.4. Primary Research
- 1.4. Information Analysis
- 1.4.1. Data Analysis Models
- 1.5. Market Formulation & Data Visualization
- 1.6. Data Validation & Publishing
- 1.7. List of Abbreviations
Chapter 2. Executive Summary
- 2.1. Market Outlook, 2023 (USD Million)
- 2.2. Segmental Outlook
- 2.3. Competitive Landscape Snapshot
Chapter 3. Semiconductor Packaging Market Variables, Trends, and Scope
- 3.1. Market Lineage Outlook
- 3.2. Penetration and Growth Prospect Mapping
- 3.3. Industry Value Chain Analysis
- 3.3.1. Raw Material Trends
- 3.3.2. Manufacturing Trends
- 3.3.3. Profit Margin Analysis
- 3.3.4. Sales Channel Analysis
- 3.4. Regulatory Framework
- 3.5. Market Dynamics
- 3.5.1. Market Driver Analysis
- 3.5.2. Market Restraint Analysis
- 3.5.3. Market Challenges Analysis
- 3.5.4. Market Opportunity Analysis
- 3.6. Business Environment Analysis
- 3.6.1. Porter's Five Fores Analysis
- 3.6.2. PESTEL Analysis
- 3.6.3. Market Entry Strategies
- 3.7. Latest Trends & Technologies in Semiconductor Packaging Market
Chapter 4. Semiconductor Packaging Market: Material Estimates & Trend Analysis
- 4.1. Definition & Scope
- 4.2. Material Movement Analysis & Market Share, 2023 & 2030
- 4.3. Organic Substrate
- 4.3.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.4. Bonding Wire
- 4.4.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.5. Leadframes
- 4.5.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.6. Encapsulation Resins
- 4.6.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.7. Ceramic Package
- 4.7.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.8. Die Attach Material
- 4.8.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.9. Thermal Interface Materials
- 4.9.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.10. Solder Balls
- 4.10.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 4.11. Others
- 4.11.1. Market estimates and forecasts, 2018-2030 (USD Million)
Chapter 5. Semiconductor Packaging Market: Technology Estimates & Trend Analysis
- 5.1. Definition & Scope
- 5.2. Technology Movement Analysis & Market Share, 2023 & 2030
- 5.3. Advanced Packaging
- 5.3.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
- 5.3.2. Flip Chip
- 5.3.3. SIP
- 5.3.4. 5D/3D
- 5.3.5. Embedded Die
- 5.3.6. Fan-in Wafer Level Packaging (FI-WLP)
- 5.3.7. Fan-out Wafer Level Packaging (FO-WLP)
- 5.4. Traditional Packaging
- 5.4.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
Chapter 6. Semiconductor Packaging Market: End Use Estimates & Trend Analysis
- 6.1. Definition & Scope
- 6.2. End Use Movement Analysis & Market Share, 2023 & 2030
- 6.3. Consumer Electronics
- 6.3.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 6.4. Automotive
- 6.4.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 6.5. Healthcare
- 6.5.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 6.6. IT & Telecommunication
- 6.6.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 6.7. Aerospace & Defense
- 6.7.1. Market estimates and forecasts, 2018-2030 (USD Million)
- 6.8. Others
- 6.8.1. Market estimates and forecasts, 2018-2030 (USD Million)
Chapter 7. Semiconductor Packaging Market: Regional Estimates & Trend Analysis
- 7.1. Key Takeaways
- 7.2. Regional Movement Analysis & Market Share, 2023 & 2030
- 7.3. North America
- 7.3.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.3.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.3.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.3.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.3.5. U.S.
- 7.3.5.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.3.5.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.3.5.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.3.5.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.3.6. Canada
- 7.3.6.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.3.6.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.3.6.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.3.6.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.3.7. Mexico
- 7.3.7.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.3.7.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.3.7.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.3.7.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.4. Europe
- 7.4.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.4.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.4.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.4.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.4.5. Germany
- 7.4.5.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.4.5.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.4.5.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.4.5.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.4.6. U.K.
- 7.4.6.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.4.6.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.4.6.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.4.6.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.4.7. France
- 7.4.7.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.4.7.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.4.7.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.4.7.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.4.8. Italy
- 7.4.8.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.4.8.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.4.8.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.4.8.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.4.9. Spain
- 7.4.9.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.4.9.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.4.9.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.4.9.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.5. Asia Pacific
- 7.5.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.5.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.5.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.5.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.5.5. China
- 7.5.5.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.5.5.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.5.5.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.5.5.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.5.6. India
- 7.5.6.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.5.6.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.5.6.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.5.6.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.5.7. Japan
- 7.5.7.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.5.7.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.5.7.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.5.7.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.5.8. South Korea
- 7.5.8.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.5.8.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.5.8.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.5.8.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.6. Central & South America
- 7.6.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.6.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.6.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.6.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.6.5. Brazil
- 7.6.5.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.6.5.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.6.5.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.6.5.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.6.6. Argentina
- 7.6.6.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.6.6.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.6.6.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.6.6.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.7. Middle East & Africa
- 7.7.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.7.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.7.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.7.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.7.5. Israel
- 7.7.5.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.7.5.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.7.5.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.7.5.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.7.6. UAE
- 7.7.6.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.7.6.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.7.6.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.7.6.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
- 7.7.7. South Africa
- 7.7.7.1. market estimates and forecasts, 2018-2030 (USD Million)
- 7.7.7.2. market estimates and forecasts, by material, 2018-2030 (USD Million)
- 7.7.7.3. market estimates and forecasts, by technology, 2018-2030 (USD Million)
- 7.7.7.4. market estimates and forecasts, by end use, 2018-2030 (USD Million)
Chapter 8. Start-up Ecosystem Evaluation, 2023
- 8.1. List of Start-up Companies
- 8.1.1. Progressive Companies
- 8.1.2. Responsive Companies
- 8.1.3. Dynamic Companies
- 8.1.4. Starting Blocks
Chapter 9. Competitive Landscape
- 9.1. Key Players & Recent Developments & Their Impact on the Industry
- 9.2. Key Company/Competition Categorization
- 9.3. List of key Raw Material Distributors and Channel Partners
- 9.4. List of Potential Customers, by End Use
- 9.5. Company Market Share & Position Analysis, 2023
- 9.6. Company Heat Map Analysis
- 9.7. Strategy Mapping
- 9.7.1. Collaboration/ Partnerships/ Agreements
- 9.7.2. New Product launches
- 9.7.3. Mergers & Acquisitions
- 9.7.4. Others
Chapter 10. Company Listing / Profiles (Business Overview, Financial Performance, Products Benchmarking, Strategic Initiatives)
- 10.1. ASE
- 10.2. Amkor Technology
- 10.3. JCET Group
- 10.4. Siliconware Precision Industries Co. Ltd.
- 10.5. Powertech Technology Inc.
- 10.6. Tianshui Huatian Technology Co. Ltd
- 10.7. Fujitsu Semiconductor Ltd
- 10.8. UTAC
- 10.9. ChipMOS Technologies Inc.
- 10.10. CHIPBOND Technology Corporation
- 10.11. Intel Corporation
- 10.12. Samsung
- 10.13. Unisem (M) Berhad
- 10.14. Camtek
- 10.15. LG Chem
Chapter 11. Strategic Recommendations/ Analyst Perspective