查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1263869

半導體晶圓拋光、研磨設備的全球市場:趨勢，機會，競爭分析(2023年～2028年)

Semiconductor Wafer Polishing and Grinding Equipment Market: Trends, Opportunities and Competitive Analysis [2023-2028]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

全球半導體晶圓拋光、研磨設備的市場規模，預計2028年達到3億3,000萬美元，2023年～2028年以5.0％的年複合成長率成長。市場主要促進因素，是對消費者電子產品的消費增加，MEMS和IC製造，光學，化合物半導體的需求增加，零件的小型化趨勢的高漲。

本報告提供全球半導體晶圓拋光、研磨設備市場相關調查分析，趨勢與預測，成長機會分析，企業簡介等資訊。

目錄

第1章 摘要整理

第2章 全球半導體晶圓拋光、研磨設備市場:市場動態

  • 簡介，背景，分類
  • 供應鏈
  • 產業的推動因素與課題

第3章 市場趨勢與預測分析(2017年～2028年)

  • 宏觀經濟趨勢(2017年～2022年)與預測(2023年～2028年)
  • 全球半導體晶圓拋光、研磨設備市場趨勢(2017年～2022年)與預測(2023年～2028年)
  • 全球半導體晶圓拋光、研磨設備市場:各類型
    • 半導體晶圓拋光設備
    • 半導體晶圓研磨設備
  • 全球半導體晶圓拋光、研磨設備市場:各最終用途產業
    • 晶圓代工廠
    • 記憶體廠商
    • IDM
    • 其他

第4章 市場趨勢與預測分析:各地區(2017年～2028年)

  • 半導體晶圓拋光、研磨設備市場:各地區
  • 北美的半導體晶圓拋光、研磨設備市場
    • 北美的半導體晶圓拋光、研磨設備市場:各類型(半導體晶圓拋光設備，半導體晶圓研磨設備)
    • 北美的半導體晶圓拋光、研磨設備市場:各最終用途產業(晶圓代工廠，記憶體廠商，IDM，其他)
  • 歐洲的半導體晶圓拋光、研磨設備市場
    • 歐洲的半導體晶圓拋光、研磨設備市場:各類型(半導體晶圓拋光設備，半導體晶圓研磨設備)
    • 歐洲的半導體晶圓拋光、研磨設備市場:各最終用途產業(晶圓代工廠，記憶體廠商，IDM，其他)
  • 亞太地區的半導體晶圓拋光、研磨設備市場
    • 亞太地區的半導體晶圓拋光、研磨設備市場:各類型(半導體晶圓拋光設備，半導體晶圓研磨設備)
    • 亞太地區的半導體晶圓拋光、研磨設備市場:各最終用途產業(晶圓代工廠，記憶體廠商，IDM，其他)
  • 其他地區的半導體晶圓拋光、研磨設備市場
    • 其他地區的半導體晶圓拋光、研磨設備市場:各類型(半導體晶圓拋光設備，半導體晶圓研磨設備)
    • 其他地區的半導體晶圓拋光、研磨設備市場:各最終用途產業(晶圓代工廠，記憶體廠商，IDM，其他)

第5章 競爭的分析

  • 產品系列分析
  • 經營的整合
  • 波特的五力分析

第6章 成長機會及策略的分析

  • 成長機會分析
    • 半導體晶圓拋光、研磨設備市場成長機會:各類型
    • 半導體晶圓拋光、研磨設備市場成長機會:各最終用途產業
    • 半導體晶圓拋光、研磨設備市場成長機會:各地區
  • 全球半導體晶圓拋光、研磨設備市場新的趨勢
  • 策略的分析
    • 新產品的開發
    • 全球半導體晶圓拋光、研磨設備市場生產能力擴大
    • 全球半導體晶圓拋光、研磨設備市場的合併，收購，合資企業
    • 檢定和授權

第7章 主要企業的企業簡介

  • Applied Materials
  • Ebara Corporation
  • Disco Corporation
  • Lapmaster
  • Logitech
  • Entrepix
  • Revasum
  • Axus Technology
簡介目錄

Semiconductor Wafer Polishing and Grinding Equipment Market Trends and Forecast

The future of the global semiconductor wafer polishing and grinding equipment market looks promising with opportunities in the foundry, memory manufacturer, and IDMs industries. The global semiconductor wafer polishing and grinding equipment market is expected to reach an estimated $0.33 billion with a CAGR of 5.0% from 2023 to 2028. The major drivers for this market are rise in the consumption of consumer electronics, increasing demand for MEMS, IC manufacturing, optics, and compound semiconductors, and growing trend for miniaturization of components.

Semiconductor Wafer Polishing and Grinding Equipment Market by Type, and End Use Industry

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Semiconductor Wafer Polishing and Grinding Equipment Market by Segments

Semiconductor Wafer Polishing and Grinding Equipment Market by Segment

The study includes a forecast for the global semiconductor wafer polishing and grinding equipment market by type, end use industry, and region, as follows:

Semiconductor Wafer Polishing and Grinding Equipment Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:

Semiconductor Wafer Polishing Equipment

Semiconductor Wafer Grinding Equipment

Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:

Foundries

Memory Manufacturers

IDMs

Others

Semiconductor Wafer Polishing and Grinding Equipment Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

North America

Europe

Asia Pacific

The Rest of the World

List of Semiconductor Wafer Polishing and Grinding Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor wafer polishing and grinding equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor wafer polishing and grinding equipment companies profiled in this report include.

Applied Materials

Ebara Corporation

Disco Corporation

Lapmaster

Logitech

Entrepix

Revasum

Axus Technology

Semiconductor Wafer Polishing and Grinding Equipment Market Insights

Lucintel forecast that semiconductor wafer polishing equipment will remain the largest type segment over the forecast period due to rapid expansion in the electronics industry that leads to increasing demand for micro electromechanical systems (MEMS), microchips, and integrated circuits for developing consumer electronic goods, such as smartphones, laptops and desktops..

Within this market, foundries is projected to record the highest growth from 2023 to 2028 due to their extensive utilization for composing integrated circuits, supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that helps the manufacturers to develop smart devices.

North American region is expected to witness the highest growth during the forecast period due to increase in demand of power semiconductor ICs for automotive applications and growing investments in electric infrastructure in this region.

Features of the Semiconductor Wafer Polishing and Grinding Equipment Market

Market Size Estimates: Semiconductor wafer polishing and grinding equipment market size estimation in terms of value ($B)

Trend and Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.

Segmentation Analysis: Semiconductor wafer polishing and grinding equipment market size by various segments, such as by type, end use industry, and region

Regional Analysis: Semiconductor wafer polishing and grinding equipment market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.

Growth Opportunities: Analysis on growth opportunities in different by type, end use industry, and regions for the semiconductor wafer polishing and grinding equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape for the semiconductor wafer polishing and grinding equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor wafer polishing and grinding equipment market size?

Answer: The global semiconductor wafer polishing and grinding equipment market is expected to reach an estimated $0.3 billion by 2028.

Q2. What is the growth forecast for semiconductor wafer polishing and grinding equipment market?

Answer: The global semiconductor wafer polishing and grinding equipment market is expected to grow with a CAGR of 5.0% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the semiconductor wafer polishing and grinding equipment market?

Answer: The major drivers for this market are rise in the consumption of consumer electronics, increasing demand for MEMS, IC manufacturing, optics, and compound semiconductors, and growing trend for miniaturization of components.

Q4. What are the major segments for semiconductor wafer polishing and grinding equipment market?

Answer: The future of the global semiconductor wafer polishing and grinding equipment market looks promising with opportunities in the foundry, memory manufacturers, and IDMs industries.

Q5. Who are the key semiconductor wafer polishing and grinding equipment companies?

Answer: Some of the key semiconductor wafer polishing and grinding equipment companies are as follows:

Applied Materials

Ebara Corporation

Disco Corporation

Lapmaster

Logitech

Entrepix

Revasum

Axus Technology

Q6. Which semiconductor wafer polishing and grinding equipment segment will be the largest in future?

Answer: Lucintel forecast that semiconductor wafer polishing equipment will remain the largest type segment over the forecast period due to rapid expansion in the electronics industry that leads to increasing demand for micro electromechanical systems (MEMS), microchips, and integrated circuits for developing consumer electronic goods, such as smartphones, laptops and desktops.

Q7. In semiconductor wafer polishing and grinding equipment market, which region is expected to be the largest in next 5 years?

Answer: North American region is expected to witness the highest growth during the forecast period due to increase in demand of power semiconductor ICs for automotive applications and growing investments in electric infrastructure in this region.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor wafer polishing and grinding equipment market by type (semiconductor wafer polishing equipment and semiconductor wafer grinding equipment), end use industry (foundries, memory manufacturers, IDMs, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity did occur in the last five years and how did they impact the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Wafer Polishing and Grinding Equipment Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Semiconductor Wafer Polishing and Grinding Equipment Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Semiconductor Wafer Polishing and Grinding Equipment Market by Type
    • 3.3.1: Semiconductor Wafer Polishing Equipment
    • 3.3.2: Semiconductor Wafer Grinding Equipment
  • 3.4: Global Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry
    • 3.4.1: Foundries
    • 3.4.2: Memory Manufacturers
    • 3.4.3: IDMs
    • 3.4.4: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Semiconductor Wafer Polishing and Grinding Equipment Market by Region
  • 4.2: North American Semiconductor Wafer Polishing and Grinding Equipment Market
    • 4.2.1: North American Semiconductor Wafer Polishing and Grinding Equipment Market by Type: Semiconductor Wafer Polishing Equipment and Semiconductor Wafer Grinding Equipment
    • 4.2.2: North American Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry: Foundries, Memory Manufacturers, IDMs, and Others
  • 4.3: European Semiconductor Wafer Polishing and Grinding Equipment Market
    • 4.3.1: European Semiconductor Wafer Polishing and Grinding Equipment Market by Type: Semiconductor Wafer Polishing Equipment and Semiconductor Wafer Grinding Equipment
    • 4.3.2: European Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry: Foundries, Memory Manufacturers, IDMs, and Others
  • 4.4: APAC Semiconductor Wafer Polishing and Grinding Equipment Market
    • 4.4.1: APAC Semiconductor Wafer Polishing and Grinding Equipment Market by Type: Semiconductor Wafer Polishing Equipment and Semiconductor Wafer Grinding Equipment
    • 4.4.2: APAC Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry: Foundries, Memory Manufacturers, IDMs, and Others
  • 4.5: ROW Semiconductor Wafer Polishing and Grinding Equipment Market
    • 4.5.1: ROW Semiconductor Wafer Polishing and Grinding Equipment Market Type: Semiconductor Wafer Polishing Equipment and Semiconductor Wafer Grinding Equipment
    • 4.5.2: ROW Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry: Foundries, Memory Manufacturers, IDMs, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Semiconductor Wafer Polishing and Grinding Equipment Market by Type
    • 6.1.2: Growth Opportunities for the Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry
    • 6.1.3: Growth Opportunities for the Semiconductor Wafer Polishing and Grinding Equipment Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Wafer Polishing and Grinding Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Wafer Polishing and Grinding Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Wafer Polishing and Grinding Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Applied Materials
  • 7.2: Ebara Corporation
  • 7.3: Disco Corporation
  • 7.4: Lapmaster
  • 7.5: Logitech
  • 7.6: Entrepix
  • 7.7: Revasum
  • 7.8: Axus Technology