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1532912

半導體封裝市場 - 2024 年至 2029 年預測

Semiconductor Packaging Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預測期內，半導體封裝市場預計將以 7.33% 的複合年成長率成長，從 2024 年的 489.66 億美元增至 2029 年的 697.33 億美元。

半導體是關鍵部件，廣泛應用於汽車、通訊、消費性電子、醫療保健和航太等多個行業。半導體具有積體電路、電子分離式元件、電晶體等多種特性。半導體是精密部件，在運送給各個最終用戶之前需要保護性包裝。半導體封裝提供保護層，保護半導體免受灰塵、刮傷以及其他物理和環境損害。

隨著全球市場對半導體的需求不斷增加，半導體封裝的需求也預計會成長。半導體是全球市場汽車的重要組成部分。半導體提供多種功能，例如支援汽車中的娛樂系統和網路連線選項。半導體還整合到汽車的各種安全系統中，例如 ADAS 系統和緊急煞車系統。根據國際工業協會（OICA）公佈的數據，2023年全球汽車產量達到約93,546,000輛。該組織還表示，在全球生產的汽車總數中，約55,115,000輛是在亞太地區生產的，其中包括中國和印度。

由於消費性電子產品需求的增加、小型化需求的成長以及5G等新興技術的採用增加，半導體封裝市場預計將以溫和的速度成長。此外，物聯網（IoT）不斷成長的需求也對半導體封裝市場產生正面影響。消費者對智慧型手錶和穿戴式裝置等小型電子設備的需求日益成長。隨著製造商尋求將所有東西都裝入有限空間的解決方案，對半導體封裝的需求正在迅速成長。因此，上述因素預計將在預測期內推動半導體封裝市場的發展。

半導體封裝市場的促進因素

  • 全球半導體需求的增加預計將推動市場成長。

半導體是電氣設備中最常用的元件之一。半導體支援通訊的使用並提供更好的計算體驗。半導體廣泛應用於各種產業，包括醫療保健、航太、汽車和消費性電子產品。半導體需求的不斷成長預計將推動全球半導體封裝市場規模的成長。

全球半導體產業的需求大幅成長，主要得益於其多產業應用。根據半導體產業協會的數據，2023年4月至2024年全球半導體需求成長約15.8%。該協會預測2024年成長率將在16%左右。 2024 年 4 月的半導體銷售額預計約為 464 億美元，高於 2023 年 4 月的 401 億美元。 2024年，美洲地區的成長率最高，約32.4%，其次是中國，約23.4%。全部區域的成長率為 11.1%。

半導體封裝市場的地理展望

  • 預計亞太地區市場將會成長。

中國的半導體產業是世界上最大的產業之一。該國對半導體抱有很高的雄心，正在發展其積體電路產業以生產更多的晶片。該國正在推動其半導體生態系統，包括代工廠、封裝設備和研究機構。

此外，中國政府正在採取一切必要措施促進國內半導體產業的發展。例如，根據半導體產業協會（SIA）的數據，政府正在認真努力減少半導體產業的差距，從 2014 年到 2030 年將投資約 1,500 億美元。因此，政府為促進半導體生產的積極投資預計將對半導體封裝市場產生積極影響。

此外，2023年9月，中國宣布將投資400億美元建造新的國家半導體產業基地。該計劃是中國與美國等國家競爭的更廣泛戰略的一部分。

中國是消費性電子產品和其他半導體相關材料的最大出口國之一。根據經濟複雜性觀察站的數據，該國出口了價值 2,720 億美元的廣播設備、價值 1,810 億美元的電腦、價值 1,110 億美元的商用機器零件和價值 702 億美元的半導體設備。這些產品的主要出口國家是美國、香港、德國和韓國。

半導體封裝的主要市場開拓：

  • 2023年，領先的半導體封裝和測試服務公司Amkor Technology宣布計劃在美國亞利桑那州建立先進的封裝和測試設施。該設施將有助於建立一個有彈性的半導體封裝供應鏈。

半導體封裝市場的主要企業：

  • Amkor Technology 總部位於美國亞利桑那州坦佩，於 1968 年在韓國開始營運，是半導體組裝和測試外包 (OSAT) 行業的領導者。此外，該公司還以其外包半導體設計、封裝和測試（OSAT）服務而聞名。
  • 富士通半導體有限公司專注於LSI製造，並為需要LSI的各種客戶提供量身定做的高可靠性解決方案，例如FeRAM（鐵電RAM）。該公司的目標是透過創新打造永續的新產品，讓世界變得更美好。
  • 英特爾公司是領先的製程技術開發商之一，也是領先的半導體製造商之一。公司的使命是塑造科技的未來，幫助創造更美好的未來。英特爾(R) Evo(TM) 筆記型電腦、英特爾博銳(R) 商用、遊戲系統、英特爾(R) Arc(TM) 獨立顯示卡、英特爾(R) Wi-Fi 產品、Thunderbolt(TM) 技術、英特爾( R) Unison(TM) 軟體和晶片組。

半導體封裝市場區隔分析如下：

按包裝類型

  • 先進封裝
  • 覆晶
  • 嵌入式晶粒
  • 扇出級封裝 (FO-WLP)
  • 扇入級封裝 (FI-WLP)

按包裝材料分

  • 有機基板
  • 導線架
  • 陶瓷封裝
  • 接合線
  • 其他

按最終用戶

  • 消費性電子產品
  • 航太/國防
  • 醫療設備
  • 通訊/電訊
  • 其他

按地區

  • 北美洲
  • 美國
  • 加拿大
  • 墨西哥
  • 南美洲
  • 巴西
  • 阿根廷
  • 其他
  • 歐洲
  • 英國
  • 德國
  • 法國
  • 義大利
  • 其他
  • 中東/非洲
  • 沙烏地阿拉伯
  • UAE
  • 其他
  • 亞太地區
  • 中國
  • 日本
  • 印度
  • 韓國
  • 泰國
  • 印尼
  • 其他

目錄

第1章簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章半導體封裝市場：依封裝類型

  • 介紹
  • 先進封裝
  • 覆晶
  • 嵌入式晶粒
  • 扇出級封裝 (FO-WLP)
  • 扇入級封裝 (FI-WLP)

第6章半導體封裝市場：依封裝材料分類

  • 介紹
  • 有機基材
  • 導線架
  • 陶瓷包裝
  • 鍵合線
  • 其他

第7章 半導體封裝市場：依最終使用者分類

  • 介紹
  • 消費性電子產品
  • 航太/國防
  • 醫療設備
  • 通訊/電訊
  • 其他

第8章半導體封裝市場：依地區

  • 介紹
  • 北美洲
    • 按包裝類型
    • 按包裝材料分
    • 按最終用戶
    • 按國家/地區
  • 南美洲
    • 按包裝類型
    • 按包裝材料分
    • 按最終用戶
    • 按國家/地區
  • 歐洲
    • 按包裝類型
    • 按包裝材料分
    • 按最終用戶
    • 按國家/地區
  • 中東/非洲
    • 按包裝類型
    • 按包裝材料分
    • 按最終用戶
    • 按國家/地區
  • 亞太地區
    • 按包裝類型
    • 按包裝材料分
    • 按最終用戶
    • 按國家/地區

第9章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第10章 公司簡介

  • ASE
  • Amkor Technology
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Limited
  • ChipMOS TECHNOLOGIES INC.
  • Intel Corporation
  • Samsung Electronics Co. Ltd
  • Unisem（M）Berhad
  • ISI-Interconnect Systems
  • Jiangsu Changjiang Electronics Technology Co. Ltd（JCET）
簡介目錄
Product Code: KSI061616099

The Semiconductor packaging market is projected to grow at a CAGR of 7.33% over the forecast period, increasing from US$48.966 billion in 2024 to US$69.733 billion by 2029.

Semiconductors are an important component applicable across multiple industries, like automotive, telecommunications, consumer electronics, healthcare, and aerospace, among others. The semiconductor has various properties like integrated circuits, electronic discrete, and transistors. it. Semiconductors are a sensitive component, so they require a protective packaging case before transporting it to various end-users. The semiconductor packaging offers a protective layer, which further helps prevent the semiconductors from dust, scratch, or any other physical or environmental damage.

The demand for semiconductor packaging is expected to grow with the increasing demand for semiconductors in the global market. Semiconductors act as an important component in automobiles in the global market. The semiconductors offer multiple features, such as enabling the entertainment system and internet connectivity options in vehicles. The semiconductors are also embedded into various safety systems of the automobile, such as the ADAS system and emergency braking systems. The global production of automotives in 2023 reached about 93.546 million units, as stated by the International Organization of Motor Vehicle Manufacturers (OICA). The organization also stated that about 55.115 million of the total vehicles produced globally, were produced in Asia Pacific region, like China and India.

The semiconductor packaging market is estimated to grow at a moderate rate, owing to the increasing demand for consumer electronics coupled with growing demand for miniaturization and increasing adoption of emerging technologies such as 5G. Additionally, the rising demand for the Internet of Things (IoT) has also had a positive impact on the semiconductor packaging market. There is a rising demand among consumers for miniaturized electronic devices such as smartwatches and wearables, among others. There is an upsurge in demand for semiconductor packaging as manufacturers are looking for solutions to fit everything in limited space. Hence, the above-listed factors are expected to propel the market for semiconductor packaging in the projected period

Semiconductor Packaging Market Drivers

  • Increasing global semiconductor demand is anticipated to propel market growth.

The semiconductor is one of the most applicable components in electrical devices. It enables the use of communications and provides a better computing experience. Semiconductors are applicable in multiple industries, such as healthcare, aerospace, automotive, and consumer electronics. The increasing demand for semiconductors is expected to boost the market size of the global semiconductor packaging market.

The global semiconductor industry has witnessed a massive boost in demand, majorly due to its multi-industry application. The global semiconductor demand increased by about 15.8% from April 2023 to 2024, as conveyed by the Semiconductor Industry Association. The industry is forecasted by the association, to achieve a growth of about 16% in 2024. The semiconductor sales in April 2024 were estimated to be about US$ 46.4 billion, which marked an increase from US$ 40.1 billion in sales in April 2023. In 2024, the Americas region observed the highest growth of about 32.4%, followed by China, which witnessed a growth of about 23.4%. The overall Asia Pacific region observed a growth of 11.1%.

Semiconductor Packaging Market Geographical Outlook

  • The market is projected to grow in the Asia Pacific region.

China's semiconductor industry is one of the largest in the world. The nation is highly ambitious about semiconductors and is developing its IC industry to produce more chips. The country has one of the boosting semiconductor ecosystems with foundries, packaging equipment, and research institutions, among others.

Additionally, the Chinese government is taking all necessary steps to promote the country's semiconductor industry. For instance, according to the Semiconductor Industry Association (SIA), the government is making serious efforts to close the gap in the semiconductor industry by investing about US$150 billion from 2014 to 2030. Hence, such booming investments by the government to promote the production of semiconductors are anticipated to have a positive impact on the semiconductor packaging market.

Moreover, in September 2023, China announced an investment of US$40 billion to build a new state-back for the semiconductor industry. This initiative is part of China's broader strategy to compete with countries like the United States.

China is one of the largest exporters of consumer electronics and other semiconductor-related materials. According to the Observatory of Economic Complexity, the country exported broadcasting equipment worth US$272 billion, computers worth US$181 billion, office machine parts worth US$111 billion, and semiconductor devices worth US$70.2 billion. The major countries where the country exported these goods were the United States, Hong Kong, Germany, and South Korea.

Semiconductor Packaging Key Market Developments:

  • In 2023, Amkor Technology, one of the leading companies in semiconductor packaging and test services, revealed its plan to create an advanced packaging and test facility in Arizona, United States. The facility will contribute to building a resilient supply chain for semiconductor packaging.

Semiconductor Packaging Market Key Players:

  • Amkor Technology, headquartered in Tempe, Arizona, United States, started its business in Korea in 1968 and is a leader in the Outsourced Semiconductor Assembly and Test (OSAT) industry. Moreover, the company is well known for outsourced (OSAT) semiconductor design, packaging, and test services. The offerings include IC semiconductor packaging, advanced packaging and testing of semiconductors, among others.
  • Fujitsu Semiconductor Limited specializes in manufacturing LSI and provides highly reliable solutions tailored to various customers who need LSI, such as FeRAM (Ferroelectric RAM). The company aims to make the world a better place by building new sustainable products with innovation. It provides FeRAM (Ferroelectric RAM), ReRAM (Resistive RAM), and Catalogs & Datasheets.
  • Intel Corporation is one of the major developers of process technology and one of the leading semiconductor manufacturers. The company's mission is to shape the future of technology to help create a better future. Popular product category includes Intel(R) Evo(TM) Laptops., Intel vPro(R) for Business., Gaming Systems, Intel (R) Arc(TM) Discrete Graphics, Intel(R) Wi-Fi Products, Thunderbolt(TM) Technology, Intel(R) Unison(TM) Software, and Chipsets among others

The Semiconductor Packaging Market is segmented and analyzed as:

By Packaging Type

  • Advanced Packaging
  • Flip Chip
  • Embedded Die
  • Fan-Out Level Packaging (FO-WLP)
  • Fan-In Level Packaging (FI-WLP)

By Packaging Material

  • Organic Substrate
  • Leadframe
  • Ceramic Packaging
  • Bonding-Wire
  • Others

By End-User

  • Consumer Electronics
  • Aerospace and Defence
  • Medical Devices
  • Communication and Telecom
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING TYPE

  • 5.1. Introduction
  • 5.2. Advanced Packaging
  • 5.3. Flip Chip
  • 5.4. Embedded Die
  • 5.5. Fan-Out Level Packaging (FO-WLP)
  • 5.6. Fan-In Level Packaging (FI-WLP)

6. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING MATERIAL

  • 6.1. Introduction
  • 6.2. Organic Substrate
  • 6.3. Leadframe
  • 6.4. Ceramic Packaging
  • 6.5. Bonding-Wire
  • 6.6. Others

7. SEMICONDUCTOR PACKAGING MARKET BY END-USER

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Aerospace and Defence
  • 7.4. Medical Devices
  • 7.5. Communication and Telecom
  • 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Packaging Type
    • 8.2.2. By Packaging Material
    • 8.2.3. By End-user
    • 8.2.4. By Country
      • 8.2.4.1. United States
      • 8.2.4.2. Canada
      • 8.2.4.3. Mexico
  • 8.3. South America
    • 8.3.1. By Packaging Type
    • 8.3.2. By Packaging Material
    • 8.3.3. By End-user
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
      • 8.3.4.2. Argentina
      • 8.3.4.3. Others
  • 8.4. Europe
    • 8.4.1. By Packaging Type
    • 8.4.2. By Packaging Material
    • 8.4.3. By End-user
    • 8.4.4. By Country
      • 8.4.4.1. Germany
      • 8.4.4.2. United Kingdom
      • 8.4.4.3. France
      • 8.4.4.4. Spain
      • 8.4.4.5. Others
  • 8.5. Middle East and Africa
    • 8.5.1. By Packaging Type
    • 8.5.2. By Packaging Material
    • 8.5.3. By End-user
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
      • 8.5.4.2. UAE
      • 8.5.4.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. By Packaging Type
    • 8.6.2. By Packaging Material
    • 8.6.3. By End-user
    • 8.6.4. By Country
      • 8.6.4.1. China
      • 8.6.4.2. Japan
      • 8.6.4.3. South Korea
      • 8.6.4.4. India
      • 8.6.4.5. Thailand
      • 8.6.4.6. Indonesia
      • 8.6.4.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. ASE
  • 10.2. Amkor Technology
  • 10.3. Powertech Technology Inc.
  • 10.4. Fujitsu Semiconductor Limited
  • 10.5. ChipMOS TECHNOLOGIES INC.
  • 10.6. Intel Corporation
  • 10.7. Samsung Electronics Co. Ltd
  • 10.8. Unisem (M) Berhad
  • 10.9. ISI - Interconnect Systems
  • 10.10. Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)